SCLS912B december   2022  – april 2023 SN74LV4T08-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics 1.8-V VCC
    7. 6.7  Switching Characteristics 2.5-V VCC
    8. 6.8  Switching Characteristics 3.3-V VCC
    9. 6.9  Switching Characteristics 5.0-V VCC
    10. 6.10 Noise Characteristics
  7. Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Balanced CMOS 3-State Outputs
      2. 9.3.2 Clamp Diode Structure
      3. 9.3.3 LVxT Enhanced Input Voltage
        1. 9.3.3.1 Down Translation
        2. 9.3.3.2 Up Translation
      4. 9.3.4 Wettable Flanks
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Power Considerations
        2. 10.2.1.2 Input Considerations
        3. 10.2.1.3 Output Considerations
      2. 10.2.2 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|14
  • BQA|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • AEC-Q100 qualified for automotive applications:

    • Device temperature grade 1: -40°C to +125°C

    • Device HBM ESD classification level 2

    • Device CDM ESD classification level C4B

  • Available in wettable flank QFN (WBQA) package

  • Wide operating range of 1.8 V to 5.5 V
  • Single-supply voltage translator (refer to LVxT Enhanced Input Voltage):

    • Up translation:

      • 1.2 V to 1.8 V

      • 1.5 V to 2.5 V

      • 1.8 V to 3.3 V

      • 3.3 V to 5.0 V

    • Down translation:

      • 5.0 V, 3.3 V, 2.5 V to 1.8 V
      • 5.0 V, 3.3 V to 2.5 V
      • 5.0 V to 3.3 V
  • 5.5-V tolerant input pins
  • Supports standard pinouts
  • Up to 150 Mbps with 5-V or 3.3-V VCC
  • Latch-up performance exceeds 250 mA per JESD 17