SCDS379
February 2018
TMUX154E
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Functional Block Diagram
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Dynamic Electrical Characteristics
6.7
Switching Characteristics
6.8
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Receiving Notification of Documentation Updates
12.3
Community Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DGS|10
MPDS035C
RSW|10
MPQF206C
Thermal pad, mechanical data (Package|Pins)
Orderable Information
scds379_oa
scds379_pm
1
Features
V
CC
Operation at 3 V to 4.3 V
I/O Pins Can Tolerate up to 5.25 V
1.8-V Compatible Control Logic
Supports Powered-off Protection I/O Pins Hi-Z When V
CC
= 0 V
R
ON
= 10 Ω Maximum
ΔR
ON
= 0.35 Ω Typical
C
io(ON)
= 7.5 pF Typical
Low Power Consumption (1 uA Maximum)
–3-dB Bandwidth = 900 MHz Typical
Latch-Up Performance Exceeds
100 mA Per JESD 78, Class II
(1)
ESD Performance Tested Per JESD 22
8000-V Human-Body Model
(A114-B, Class II)
1000-V Charged-Device Model (C101)
ESD Performance I/O Port to GND
(2)
15000-V Human-Body Model
1.
Except
EN
and SEL Inputs
2.
High-voltage HBM is performed in addition to the standard HBM testing (A114-B, Class II) and applies to I/O ports tested with respect to GND only.
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