SLVSDP1F january   2017  – may 2023 TPS65235-1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Boost Converter
      2. 7.3.2  Linear Regulator and Current Limit
      3. 7.3.3  Boost Converter Current Limit
      4. 7.3.4  Charge Pump
      5. 7.3.5  Slew Rate Control
      6. 7.3.6  Short-Circuit Protection, Hiccup, and Overtemperature Protection
      7. 7.3.7  Tone Generation
      8. 7.3.8  Tone Detection
      9. 7.3.9  Audio Noise Rejection
      10. 7.3.10 Disable and Enable
      11. 7.3.11 Component Selection
        1. 7.3.11.1 Boost Inductor
        2. 7.3.11.2 Capacitor Selection
        3. 7.3.11.3 Surge Components
        4. 7.3.11.4 Consideration for Boost Filtering and LNB Noise
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface Description
      2. 7.5.2 TPS65235-1 I2C Update Sequence
    6. 7.6 Register Maps
      1. 7.6.1 Control Register 1 (address = 0x00) [reset = 0x08]
      2. 7.6.2 Control Register 2 (address = 0x01) [reset = 0x09]
      3. 7.6.3 Status Register (address = 0x02) [reset = 0x29]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DiSEqc1.x Support
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DiSEqc2.x Support
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Complete integrated solution for LNB and I2C interface
  • DiSEqC 2.x, and DiSEqC 1.x compatible
  • Supports 5-V, 12-V, and 15-V power rail
  • Up to 1000-mA accurate output current limit adjustable by external resistor
  • Boost switch peak current limit proportional to LDO current limit
  • Boost converter with 140-mΩ low Rds(on) internal power switch
  • Boost switching frequency 1-MHz or 500-kHz selectable
  • Audible noise avoided at force PWM mode
  • Dedicated enable pin for non-I2C application
  • Low-dropout (LDO) regulator with push-pull output stage for VLNB output
  • Built-in accurate 22-kHz tone generator and external tone input support
  • Supports both external 44-kHz and 22-kHz tone input
  • Adjustable soft start and 13-V to 18-V voltage transition time
  • 650-mV to 750-mV 22-kHz tone amplitude selection
  • I2C registers accessible with EN low
  • Short circuit dynamic protection
  • Diagnostics for output voltage level, DiSEqC tone input and output, current level, and cable connection
  • Thermal protection available
  • 20-pin WQFN 3-mm × 3-mm (RUK) package
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