Product details

Technology family ACT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 1 Inputs per channel 8 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type TTL-Compatible CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 90 Rating Catalog Operating temperature range (°C) -40 to 85
Technology family ACT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 1 Inputs per channel 8 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type TTL-Compatible CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 90 Rating Catalog Operating temperature range (°C) -40 to 85
PDIP (N) 14 181.42 mm² 19.3 x 9.4 SOIC (D) 14 51.9 mm² 8.65 x 6
  • Inputs Are TTL-Voltage Compatible
  • Flow-Through Architecture Optimizes PCB Layout
  • Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise
  • EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
  • 500-mA Typical Latch-Up Immunity
    at 125°C
  • Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs

 

EPIC is a trademark of Texas Instruments Incorporated.

  • Inputs Are TTL-Voltage Compatible
  • Flow-Through Architecture Optimizes PCB Layout
  • Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise
  • EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
  • 500-mA Typical Latch-Up Immunity
    at 125°C
  • Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs

 

EPIC is a trademark of Texas Instruments Incorporated.

These devices contain a single 8-input NAND gate and perform the following Boolean functions in positive logic:

  • or
    + D\ + E\ + F\ + G\ + H\

The 54ACT11030 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74ACT11030 is characterized for operation from -40°C to 85°C.

 

 

These devices contain a single 8-input NAND gate and perform the following Boolean functions in positive logic:

  • or
    + D\ + E\ + F\ + G\ + H\

The 54ACT11030 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74ACT11030 is characterized for operation from -40°C to 85°C.

 

 

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Technical documentation

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Type Title Date
* Data sheet 8-Input Positive-NAND Gates datasheet 01 Apr 1993
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 01 Apr 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

14-24-LOGIC-EVM — Logic product generic evaluation module for 14-pin to 24-pin D, DB, DGV, DW, DYY, NS and PW packages

The 14-24-LOGIC-EVM evaluation module (EVM) is designed to support any logic device that is in a 14-pin to 24-pin D, DW, DB, NS, PW, DYY or DGV package,

User guide: PDF | HTML
Not available on TI.com
Simulation model

74ACT11030 Behavioral SPICE Model

SCAM075.ZIP (7 KB) - PSpice Model
Package Pins CAD symbols, footprints & 3D models
PDIP (N) 14 Ultra Librarian
SOIC (D) 14 Ultra Librarian

Ordering & quality

Information included:
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  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

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