CSD95472Q5MC

ACTIVE

20 V 60 A SON 5 x 6 mm DualCool synchronous buck NexFET™ power stage

CSD95472Q5MC

ACTIVE

Product details

VDS (V) 20 Ploss current (A) 30 Rating Catalog Operating temperature range (°C) -55 to 150
VDS (V) 20 Ploss current (A) 30 Rating Catalog Operating temperature range (°C) -55 to 150
VSON-CLIP (DMC) 12 30 mm² 6 x 5
  • 60-A Continuous Operating Current Capability
  • 94.4% System Efficiency at 1.2 V / 30 A
  • Low Power Loss of 2.3 W at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Mode With FCCM
  • Temperature-Compensated Bidirectional Current
    Sense
  • Analog Temperature Output (600 mV at 0°C)
  • Fault Monitoring
    • High-Side Short, Overcurrent, and
      Overtemperature Protection
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Optimized Deadtime for Shoot-Through Protection
  • High-Density SON 5 × 6 mm Footprint
  • Ultralow Inductance Package
  • System-Optimized PCB Footprint
  • DualCool™ Packaging
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free
  • 60-A Continuous Operating Current Capability
  • 94.4% System Efficiency at 1.2 V / 30 A
  • Low Power Loss of 2.3 W at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Mode With FCCM
  • Temperature-Compensated Bidirectional Current
    Sense
  • Analog Temperature Output (600 mV at 0°C)
  • Fault Monitoring
    • High-Side Short, Overcurrent, and
      Overtemperature Protection
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Optimized Deadtime for Shoot-Through Protection
  • High-Density SON 5 × 6 mm Footprint
  • Ultralow Inductance Package
  • System-Optimized PCB Footprint
  • DualCool™ Packaging
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free

The CSD95472Q5MC NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and Power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5 mm × 6 mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95472Q5MC NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and Power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5 mm × 6 mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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Technical documentation

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* Data sheet CSD95472Q5MC Synchronous Buck NexFET Smart Power Stage datasheet PDF | HTML 12 Feb 2016

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation model

CSD95472Q5MC PSpice Transient Model

SLPM172.ZIP (24 KB) - PSpice Model
Reference designs

PMP20176 — 4 Phase, 140 A Reference Design for Intel Stratix 10 GX FPGAs

This reference design focuses on providing a compact, high-performance, multiphase solution suitable for powering Intel® Stratix® 10 GX field-programmable gate arrays (FPGAs) with a specific focus on the SG2800-I1V variant. Integrated PMBus™ allows for easy output voltage setting and (...)
Test report: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
VSON-CLIP (DMC) 12 Ultra Librarian

Ordering & quality

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  • MSL rating/Peak reflow
  • MTBF/FIT estimates
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  • Ongoing reliability monitoring
Information included:
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  • Assembly location

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