The LMZ31710 power module is an easy-to-use integrated power solution that combines a 10-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low-profile QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.
The 10 × 10 × 4.3 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. The device achieves greater than 95% efficiency and excellent power dissipation capability with a thermal impedance of 13.3°C/W. The LMZ31710 offers the flexibility and the feature set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
For additional terms or required resources, click any title below to view the detail page where available.
The LMZ31710 EVM is designed to help the user easily evaluate and test the operation and functionality of the LMZ31710 buck module. The EVM convert a 2.95-V to 17-V input voltage to a regulated 0.6-V to 5-V output voltage that delivers up to 10 A in a 10-mm x 10-mm QFN package. The output (...)
The LMZ31710X2EVM is designed to help the user easily evaluate and test the operation and functionality of the LMZ31710 buck module in two-phase configuration. The EVM convert a 2.95-V to 17-V input voltage to a regulated output voltage (0.6 V, 0.9 V, 1.2 V, and 1.8 V selected using a jumper) that (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| B3QFN (RVQ) | 42 | Ultra Librarian |
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.