SN54SLC8T245-SEP

ACTIVE

Radiation-tolerant, eight-bit, 0.65-V to 3.3-V, direction-controlled level translator

SN54SLC8T245-SEP

ACTIVE

Product details

Technology family SLC Applications RGMII Bits (#) 8 High input voltage (min) (V) 0.4555 High input voltage (max) (V) 3.6 Vout (min) (V) 0.65 Vout (max) (V) 3.6 Data rate (max) (Mbps) 380 IOH (max) (mA) -12 IOL (max) (mA) 12 Supply current (max) (µA) 70 Features Output enable, Overvoltage tolerant inputs, Partial power down (Ioff), Vcc isolation Input type Standard CMOS Output type 3-State, Balanced CMOS, Push-Pull Rating Space Operating temperature range (°C) -55 to 125
Technology family SLC Applications RGMII Bits (#) 8 High input voltage (min) (V) 0.4555 High input voltage (max) (V) 3.6 Vout (min) (V) 0.65 Vout (max) (V) 3.6 Data rate (max) (Mbps) 380 IOH (max) (mA) -12 IOL (max) (mA) 12 Supply current (max) (µA) 70 Features Output enable, Overvoltage tolerant inputs, Partial power down (Ioff), Vcc isolation Input type Standard CMOS Output type 3-State, Balanced CMOS, Push-Pull Rating Space Operating temperature range (°C) -55 to 125
TSSOP (PW) 24 49.92 mm² 7.8 x 6.4
  • VID V62/22604

  • Radiation tolerant:
    • Single event latch-up (SEL) immune up to 43 MeV-cm 2 /mg at 125°C
    • Total ionizing dose (TID) Radiation Lot Acceptance Testing (RLAT) for every wafer lot up to 20 krad(Si)
  • Qualified, fully configurable dual-rail design allows each port to operate with a power supply range from 0.65 V to 3.6 V
  • Operating temperature from –55°C to +125°C
  • Multiple direction-control pins allows simultaneous up and down translation
  • Up to 380 Mbps support when translating from 1.8 V to 3.3 V
  • V CC isolation feature that effectively isolates both buses in a power-down scenario
  • Partial power-down mode to limit backflow current in a power-down scenario
  • Latch-up performance exceeds 100 mA per JESD 78, class II
  • ESD protection exceeds JESD 22
    • 8000-V human-body model
    • 1000-V charged-device model
  • VID V62/22604

  • Radiation tolerant:
    • Single event latch-up (SEL) immune up to 43 MeV-cm 2 /mg at 125°C
    • Total ionizing dose (TID) Radiation Lot Acceptance Testing (RLAT) for every wafer lot up to 20 krad(Si)
  • Qualified, fully configurable dual-rail design allows each port to operate with a power supply range from 0.65 V to 3.6 V
  • Operating temperature from –55°C to +125°C
  • Multiple direction-control pins allows simultaneous up and down translation
  • Up to 380 Mbps support when translating from 1.8 V to 3.3 V
  • V CC isolation feature that effectively isolates both buses in a power-down scenario
  • Partial power-down mode to limit backflow current in a power-down scenario
  • Latch-up performance exceeds 100 mA per JESD 78, class II
  • ESD protection exceeds JESD 22
    • 8000-V human-body model
    • 1000-V charged-device model

The SN54SLC8T245-SEP device is an 8-bit non-inverting bus transceiver that resolves voltage level mismatch between devices operating at the latest voltage nodes (0.7 V, 0.8 V, and 0.9 V) and devices operating at industry standard voltage nodes (1.8 V, 2.5 V, and 3.3 V).

The device operates by using two independent power-supply rails (V CCA and V CCB) that operate as low as 0.65 V. Data pins A1 through A8 are designed to track V CCA, which accepts any supply voltage from 0.65 V to 3.6 V. Data pins B1 through B8 are designed to track V CCB, which accepts any supply voltage from 0.65 V to 3.6 V.

The SN54SLC8T245-SEP device is designed for asynchronous communication between data buses. The device transmits data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level of the direction-control inputs (DIR1 and DIR2). The output-enable ( OE) input is used to disable the outputs so the buses are effectively isolated.

The SN54SLC8T245-SEP device is designed so the control pins (DIR and OE) are referenced to V CCA.

This device is fully specified for partial-power-down applications using I off. The I off circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

The V CC isolation feature is designed so that if either V CC input supply is below 100 mV, all level shifter outputs are disabled and placed into a high-impedance state.

To put the level shifter I/Os in the high-impedance state during power up or power down, tie OE to V CCA through a pullup resistor; the current-sinking capability of the driver determines the minimum value of the resistor.

The SN54SLC8T245-SEP device is an 8-bit non-inverting bus transceiver that resolves voltage level mismatch between devices operating at the latest voltage nodes (0.7 V, 0.8 V, and 0.9 V) and devices operating at industry standard voltage nodes (1.8 V, 2.5 V, and 3.3 V).

The device operates by using two independent power-supply rails (V CCA and V CCB) that operate as low as 0.65 V. Data pins A1 through A8 are designed to track V CCA, which accepts any supply voltage from 0.65 V to 3.6 V. Data pins B1 through B8 are designed to track V CCB, which accepts any supply voltage from 0.65 V to 3.6 V.

The SN54SLC8T245-SEP device is designed for asynchronous communication between data buses. The device transmits data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level of the direction-control inputs (DIR1 and DIR2). The output-enable ( OE) input is used to disable the outputs so the buses are effectively isolated.

The SN54SLC8T245-SEP device is designed so the control pins (DIR and OE) are referenced to V CCA.

This device is fully specified for partial-power-down applications using I off. The I off circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

The V CC isolation feature is designed so that if either V CC input supply is below 100 mV, all level shifter outputs are disabled and placed into a high-impedance state.

To put the level shifter I/Os in the high-impedance state during power up or power down, tie OE to V CCA through a pullup resistor; the current-sinking capability of the driver determines the minimum value of the resistor.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 7
Type Title Date
* Data sheet SN54SLC8T245-SEP8-Bit Dual-Supply Bus Transceiver With Configurable Voltage Translation and Tri-State Outputs datasheet (Rev. B) PDF | HTML 05 Dec 2023
* Radiation & reliability report SN54SLC8T245-SEP Production Flow and Reliability Report PDF | HTML 20 Oct 2022
* Radiation & reliability report SN54SLC8T245-SEP Single Event Effects Report PDF | HTML 12 Oct 2022
* Radiation & reliability report SN54SLC8T245-SEP Total Ionizing Dose (TID) PDF | HTML 03 Oct 2022
Application brief TI Space Enhanced Plastic Logic Overview and Applications in Low-Earth Orbit Satellite Platforms PDF | HTML 10 Sep 2024
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 12 Jul 2024
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 03 Jul 2024

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

AVCLVCDIRCNTRL-EVM — Generic EVM for Direction-Controlled Bidirectional Translation Device Supporting AVC and LVC

The generic EVM is designed to support one, two, four and eight channel LVC and AVC direction-controlled translation devices. It also supports the bus hold and automotive -Q1 devices in the same number of channels. The AVC are low voltage translation devices with lower drive strength of 12mA. LVC (...)

User guide: PDF
Not available on TI.com
Evaluation board

ALPHA-3P-ADM-VA600-SPACE-AMD — Alpha Data ADM-VA600 kit using AMD Versal core XQRVC1902 ACAP and TI radiation-tolerant products

This is a 6U VPX form factor highlighting the AMD-Xilinx® Versal AI Core XQRVC1902 adaptable SoC/FPGA. The ADM-VA600 is modular board design with one FMC+ connector, DDR4 DRAM and system monitoring. The majority of the components are radiation-tolerant power management, interface, clocking and (...)

Evaluation board

ALPHA-3P-ADM-VA601-SPACE-AMD — Alpha Data ADM-VA601 kit using AMD Versal core XQRVC1902 ACAP and TI radiation-tolerant products

This is a 6U VPX form factor highlighting the AMD-Xilinx® Versal AI Core XQRVC1902 adaptable SoC/FPGA. The ADM-VA600 is modular board design with one FMC+ connector, DDR4 DRAM and system monitoring. The majority of the components are radiation-tolerant power management, interface, clocking and (...)

Simulation model

SN54SLC8T245-SEP IBIS Model (Rev. B)

SCEM795B.ZIP (82 KB) - IBIS Model
Package Pins CAD symbols, footprints & 3D models
TSSOP (PW) 24 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos