The SN65LVDS31 is a differential line driver that implements the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as TIA/EIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. This driver will deliver a minimum differential output voltage magnitude of 247 mV into a 100-Ω load when enabled.
The intended application of this device and signaling technique is both point-to-point and multidrop (one driver and multiple receivers) data transmission over controlled impedance media of approximately 100 Ω. The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.
The SN65LVDS31 is characterized for operation from –55°C to 125°C.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | SN65LVDS31-EP High-Speed Differential Line Drivers datasheet | 22 Sep 2011 | |
| * | VID | SN65LVDS31-EP VID V6207627 | 21 Jun 2016 | |
| * | Radiation & reliability report | SN65LVDS31MDREP Reliability Report | 07 Jan 2013 | |
| Application brief | LVDS to Improve EMC in Motor Drives | 27 Sep 2018 | ||
| Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 03 Aug 2018 | ||
| Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 16 May 2018 |
For additional terms or required resources, click any title below to view the detail page where available.
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TI offers a series of low-voltage differential signaling (LVDS) evaluation modules (EVMs) designed for analysis of the electrical characteristics of LVDS drivers and receivers. Four unique EVMs are available to evaluate the different classes of LVDS devices offered by TI.
As seen (...)
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TI offers a series of low-voltage differential signaling (LVDS) evaluation modules (EVMs) designed for analysis of the electrical characteristics of LVDS drivers and receivers. Four unique EVMs are available to evaluate the different classes of LVDS devices offered by TI.
As seen in the Combination (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| SOIC (D) | 16 | Ultra Librarian |
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