The SN74GTLP817 is a medium-drive fanout driver that provides LVTTL-to-GTLP and GTLP-to-LVTTL
signal-level translation. The device provides a high-speed interface between cards operating at LVTTL logic
levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard
TTL or LVTTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input
threshold levels, improved differential input, and OEC™ circuitry. The improved GTLP OEC circuitry minimizes
bus settling time and has been designed and tested using several backplane models. The medium drive allows
incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 19 . BO1 and
BO2 can be tied together to drive an equivalent load impedance down to 11 .
GTLP is the Texas Instruments (TI™) derivative of the Gunning Transceiver Logic (GTL) JEDEC standard
JESD 8-3. The ac specification of the SN74GTLP817 is given only at the preferred higher noise-margin GTLP,
but the user has the flexibility of using this device at either GTL (VTT = 1.2 V and V REF = 0.8 V) or GTLP
(VTT = 1.5 V and VREF = 1 V) signal levels.
Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels
but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREF is the B-port differential input
reference voltage.
GNDT is the TTL output ground, while GNDG is the GTLP output ground, and both may be separated from each
other for a quieter device.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the device when it is powered down. The
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
This device features adjustable edge-rate control (ERC). Changing the ERC input voltage between GND and
VCC adjusts the B-port output rise and fall times. This allows the designer to optimize system data-transfer rate
and signal integrity to the backplane load. ERC automatically is selected to the same speed as alternate source
1-to-6 fanout drivers that use pin 18 for 3.3-V or 5-V VCC .
When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCC
through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of
the driver.
The SN74GTLP817 is a medium-drive fanout driver that provides LVTTL-to-GTLP and GTLP-to-LVTTL
signal-level translation. The device provides a high-speed interface between cards operating at LVTTL logic
levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard
TTL or LVTTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input
threshold levels, improved differential input, and OEC™ circuitry. The improved GTLP OEC circuitry minimizes
bus settling time and has been designed and tested using several backplane models. The medium drive allows
incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 19 . BO1 and
BO2 can be tied together to drive an equivalent load impedance down to 11 .
GTLP is the Texas Instruments (TI™) derivative of the Gunning Transceiver Logic (GTL) JEDEC standard
JESD 8-3. The ac specification of the SN74GTLP817 is given only at the preferred higher noise-margin GTLP,
but the user has the flexibility of using this device at either GTL (VTT = 1.2 V and V REF = 0.8 V) or GTLP
(VTT = 1.5 V and VREF = 1 V) signal levels.
Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels
but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREF is the B-port differential input
reference voltage.
GNDT is the TTL output ground, while GNDG is the GTLP output ground, and both may be separated from each
other for a quieter device.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the device when it is powered down. The
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
This device features adjustable edge-rate control (ERC). Changing the ERC input voltage between GND and
VCC adjusts the B-port output rise and fall times. This allows the designer to optimize system data-transfer rate
and signal integrity to the backplane load. ERC automatically is selected to the same speed as alternate source
1-to-6 fanout drivers that use pin 18 for 3.3-V or 5-V VCC .
When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCC
through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of
the driver.