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D-type flip-flops

SN74HC174A

ACTIVE

Hex D-Type Flip-Flops With Clear

Order now

SN74HC174A

ACTIVE
Order now

Product details

Technology family HC Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Input type CMOS Output type CMOS IOL (max) (mA) 5.2 IOH (max) (mA) -5.2 Operating temperature range (°C) to Rating Catalog
Technology family HC Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Input type CMOS Output type CMOS IOL (max) (mA) 5.2 IOH (max) (mA) -5.2 Operating temperature range (°C) to Rating Catalog
TSSOP (PW) 16 32 mm² 5 x 6.4
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Technical documentation

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Type Title Date
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions 01 May 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 01 Apr 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

14-24-LOGIC-EVM — Logic product generic evaluation module for 14-pin to 24-pin D, DB, DGV, DW, DYY, NS and PW packages

The 14-24-LOGIC-EVM evaluation module (EVM) is designed to support any logic device that is in a 14-pin to 24-pin D, DW, DB, NS, PW, DYY or DGV package,

User guide: PDF | HTML
Not available on TI.com
Package Pins CAD symbols, footprints & 3D models
TSSOP (PW) 16 Ultra Librarian
TI's Standard Terms and Conditions for Evaluation Items apply.

Ordering & quality

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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

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