The TLV247x is a family of CMOS rail-to-rail input/output operational amplifiers that establishes a new performance point for supply current versus ac performance. These devices consume just 600 µA/channel while offering 2.8 MHz of gain-bandwidth product. Along with increased ac performance, the amplifier provides high output drive capability, solving a major shortcoming of older micropower operational amplifiers. The TLV247x can swing to within 180 mV of each supply rail while driving a 10-mA load. For non-RRO applications, the TLV247x can supply ±35 mA at 500 mV off the rail. Both the inputs and outputs swing rail-to-rail for increased dynamic range in low-voltage applications. This performance makes the TLV247x family ideal for sensor interface, portable medical equipment, and other data acquisition circuits.
The family is fully specified at 3 V and 5 V across the automotive temperature range (–40°C to 125°C).
Products with similar specifications, sorted by available TI.com inventory. View now
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | Family of 600-uA/Ch 2.8-MHz Rail-to-Rail Input/Output High-Drive Op Amps datasheet (Rev. B) | 30 Apr 2008 | |
| E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 28 Mar 2017 |
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The amplifier performance development kit (PDK) is an evaluation module (EVM) kit to test common operational amplifier (op amp) parameters and is compatible with most op amps and comparators. The EVM kit offers a main board with several socketed daughtercard options to fit package needs, allowing (...)
Speed up your op amp prototyping and testing with the DIP adapter evaluation module (DIP-ADAPTER-EVM), which provides a fast, easy and inexpensive way to interface with small surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them (...)
The DIYAMP-EVM is an evaluation module (EVM) family that provides engineers and do it yourselfers (DIYers) with real-world amplifier circuits, enabling you to quickly evaluate design concepts and verify simulations. It is available in three industry-standard packages (SC70, SOT-23 and SOIC) (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| SOT-23 (DBV) | 5 | Ultra Librarian |
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