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TPD1E1B04

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1-pF, ±3.6-V, ±30-kV ESD protection diode with 6.3-A 8/20-uS surge & low clamping in 0402 packa

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Data sheet

TPD1E1B04

ACTIVE
Data sheet Order now

Product details

Package name DFN-1006 (X1SON) Peak pulse power (8/20 μs) (max) (W) 50 Vrwm (V) 3.6 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 1 IEC 61000-4-2 contact (±V) 30000 IEC 61000-4-5 (A) 6.3 Clamping voltage (V) 6.3 Dynamic resistance (typ) 0.15 Interface type Audio, Ethernet, General purpose, LVDS, USB 2.0 Breakdown voltage (min) (V) 6.4 IO leakage current (max) (nA) 100 Rating Catalog Operating temperature range (°C) -40 to 125
Package name DFN-1006 (X1SON) Peak pulse power (8/20 μs) (max) (W) 50 Vrwm (V) 3.6 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 1 IEC 61000-4-2 contact (±V) 30000 IEC 61000-4-5 (A) 6.3 Clamping voltage (V) 6.3 Dynamic resistance (typ) 0.15 Interface type Audio, Ethernet, General purpose, LVDS, USB 2.0 Breakdown voltage (min) (V) 6.4 IO leakage current (max) (nA) 100 Rating Catalog Operating temperature range (°C) -40 to 125
X1SON (DPY) 2 0.6 mm² 1 x 0.6
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±30-kV Contact Discharge
    • ±30-kV Air Gap Discharge
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 6.3 A (8/20 µs)
  • IO Capacitance: 1 pF (Typical)
  • DC Breakdown Voltage: 6.4 V (Typical)
  • Low Leakage Current: 100 nA (Maximum)
  • Extremely Low ESD Clamping Voltage
    • 8.5 V at ±16-A TLP
    • RDYN: 0.15 Ω
  • Industrial Temperature Range: –40°C to +125°C
  • Industry Standard 0402 Package

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  • IEC 61000-4-2 Level 4 ESD Protection
    • ±30-kV Contact Discharge
    • ±30-kV Air Gap Discharge
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 6.3 A (8/20 µs)
  • IO Capacitance: 1 pF (Typical)
  • DC Breakdown Voltage: 6.4 V (Typical)
  • Low Leakage Current: 100 nA (Maximum)
  • Extremely Low ESD Clamping Voltage
    • 8.5 V at ±16-A TLP
    • RDYN: 0.15 Ω
  • Industrial Temperature Range: –40°C to +125°C
  • Industry Standard 0402 Package

All trademarks are the property of their respective owners.

The TPD1E1B04 is a bidirectional TVS ESD protection diode featuring low RDYN and low clamping voltage. The TPD1E1B04 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

The ultra-low dynamic resistance (0.15 Ω) and extremely low clamping voltage (8.5 V at 16-A TLP) ensure system level protection against transient events. This device features a 1-pF IO capacitance making it ideal for protecting interfaces such as USB 2.0.

The TPD1E1B04 is offered in the industry standard 0402 (DPY) package.

The TPD1E1B04 is a bidirectional TVS ESD protection diode featuring low RDYN and low clamping voltage. The TPD1E1B04 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

The ultra-low dynamic resistance (0.15 Ω) and extremely low clamping voltage (8.5 V at 16-A TLP) ensure system level protection against transient events. This device features a 1-pF IO capacitance making it ideal for protecting interfaces such as USB 2.0.

The TPD1E1B04 is offered in the industry standard 0402 (DPY) package.
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Technical documentation

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Type Title Date
* Data sheet TPD1E1B04 1-Channel ESD Protection Diode with Low RDYN and Low Clamping Voltage datasheet (Rev. A) PDF | HTML 10 Jun 2016
Application note ESD and Surge Protection for USB Interfaces (Rev. B) PDF | HTML 11 Jan 2024
Selection guide System-Level ESD Protection Guide (Rev. D) 07 Sep 2022
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 18 Aug 2022
Technical article ESD Fundamentals Part 2: IEC 61000-4-2 Rating PDF | HTML 28 Nov 2017
Technical article The dangers of deep snap-back ESD circuit-protection diodes PDF | HTML 12 Sep 2016

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The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested. For typical (...)
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TPD1E1B04 IBIS Model

SLVMBP5.ZIP (3 KB) - IBIS Model
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Simulation model

TPD1E1B04 S-Parameter Model

SLVMBP6.ZIP (29 KB) - IBIS Model
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