DS90CF386
- 20-MHz to 85-MHz Shift Clock Support
- Rx Power Consumption <142 mW (Typical) at
85-MHz Grayscale - Rx Power-Down Mode <1.44 mW (Maximum)
- ESD Rating >7 kV (HBM), >700 V (EIAJ)
- Supports VGA, SVGA, XGA, and Single Pixel
SXGA - PLL Requires No External Components
- Compatible With TIA/EIA-644 LVDS Standard
- Low Profile 56-Pin or 48-Pin TSSOP Package
- DS90CF386 Also Available in a 64-Pin, 0.8-mm,
Fine Pitch Ball Grid Array (NFBGA) Package
The DS90CF386 receiver converts four LVDS (Low Voltage Differential Signaling) data streams back into parallel 28 bits of LVCMOS data. Also available is the DS90CF366 receiver that converts three LVDS data streams back into parallel 21 bits of LVCMOS data. The outputs of both receivers strobe on the falling edge. A rising edge or falling edge strobe transmitter will interoperate with a falling edge strobe receiver without any translation logic.
The receiver LVDS clock operates at rates from 20 MHz to 85 MHz. The device phase-locks to the input LVDS clock, samples the serial bit streams at the LVDS data lines, and converts them into parallel output data. At an incoming clock rate of 85 MHz, each LVDS input line is running at a bit rate of 595 Mbps, resulting in a maximum throughput of 2.38 Gbps for the DS90CF386 and 1.785 Gbps for the DS90CF366.
The use of these serial link devices is ideal for solving EMI and cable size problems associated with transmitting data over wide, high-speed parallel LVCMOS interfaces. Both devices are offered in TSSOP packages. The DS90CF386 is also offered in a 64-pin, 0.8-mm, fine pitch ball grid array (NFBGA) package which provides a 44% reduction in PCB footprint compared to the 56-pin TSSOP package.
技术文档
| 类型 | 标题 | 下载最新的英语版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 数据表 | DS90CF3x6 3.3-V LVDS Receiver 24-Bit Or 18-Bit Flat Panel Display (FPD) Link, 85 MHz 数据表 (Rev. J) | PDF | HTML | 2016年 5月 31日 | ||
| 应用手册 | High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs | 2018年 11月 9日 | ||||
| 应用手册 | How to Map RGB Signals to LVDS/OpenLDI(OLDI) Displays (Rev. A) | 2018年 6月 29日 | ||||
| 应用手册 | AN-1032 An Introduction to FPD-Link (Rev. C) | 2017年 8月 8日 | ||||
| 用户指南 | FLINK3V8BT-85 Evaluation Kit (Rev. A) | 2016年 8月 24日 | ||||
| 应用手册 | Receiver Skew Margin for Channel Link I and FPD Link I Devices | 2016年 1月 13日 | ||||
| 应用手册 | TFT Data Mapping for Dual Pixel LDI Application - Alternate A - Color Map | 2004年 5月 15日 | ||||
| 应用手册 | AN-1056 STN Application Using FPD-Link | 2004年 5月 14日 | ||||
| 应用手册 | AN-1085 FPD-Link PCB and Interconnect Design-In Guidelines | 2004年 5月 14日 |
设计和开发
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FLINK3V8BT-85 — 用于 FPD 链接系列串行器和解串器 LVDS 器件的评估套件
FPD-Link evaluation kit contains a Transmitter (Tx) board, a Receiver (Rx) board along with interfacing cables. This kit will demonstrate the chipsets interfacing from test equipment or a graphics controller using Low Voltage Differential Signaling (LVDS) to a receiver board.
The Transmitter board (...)
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| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| NFBGA (NZC) | 64 | Ultra Librarian |
| TSSOP (DGG) | 56 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
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