可提供此米6体育平台手机版_好二三四的更新版本
功能优于所比较器件的普遍直接替代米6体育平台手机版_好二三四
ISO722-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1:
–40ºC to 125ºC Ambient Operating Temperature Range - Device HBM ESD Classification Level H2
- Device CDM ESD Classification Level C5
- Device Temperature Grade 1:
- 4000-V(peak) Isolation
- UL 1577, IEC 60747-5-2 (VDE 0884, Rev 2), IEC 61010-1
- 50-kV/s Transient Immunity (Typ)
- Signaling Rate 0 Mbps to 100 Mbps
- Low Propagation Delay
- Low Pulse Skew
(Pulse-Width Distortion)
- Low-Power Sleep Mode
- High Electromagnetic Immunity
- Low Input Current Requirement
- Failsafe Output
- Drop-In Replacement for Most Optical and Magnetic Isolators
(1) The signaling rate of a line is the number of voltage transitions that occur per second, expressed in the units bps (bits per second).
The ISO72x-Q1 is a digital isolator with a logic input and output buffer separated by a silicon oxide (SiO2) insulation barrier. This barrier provides galvanic isolation of up to 4000 V. Used in conjunction with isolated power supplies, this device prevents noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry.
The capacitive isolation barrier conditions, translates to a balanced signal, then differentiates a binary input signal. Across the isolation barrier, a differential comparator receives the logic-transition information, then sets or resets a flip-flop and the output circuit accordingly. A periodic update pulse sent across the barrier ensures the proper dc level of the output. On failure to receive this dc refresh pulse for more than 4 µs, the response of the device is as if the input is or not actively driven, and the failsafe circuit drives the output to a logic-high state.
The symmetry of the dielectric and capacitor within the integrated circuitry provides for close capacitive matching and allows fast transient voltage changes between the input and output grounds without corrupting the output. The small capacitance and resulting time constant provide for fast operation with signaling rates(1) from 0 Mbps (dc) to 100 Mbps.
The device requires two supply voltages of 3.3 V, 5 V, or any combination. All inputs are 5-V tolerant when supplied from a 3.3-V supply, and all outputs are 4-mA CMOS. The device has a TTL input threshold and a noise filter at the input that prevents transient pulses of up to 2 ns in duration from being passed to the output of the device.
The ISO722-Q1 device includes an active-low output enable that, when driven to a high logic level, places the output in a high-impedance state and turns off internal bias circuitry to conserve power.
The ISO72x-Q1 is characterized for operation over the ambient temperature range of –40°C to 125°C.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | 3.3-V / 5-V High-Speed Digital Isolator 数据表 (Rev. C) | 2013年 7月 25日 | |||
证书 | VDE Certificate for Basic Isolation for DIN EN IEC 60747-17 (Rev. W) | 2024年 1月 31日 | ||||
白皮书 | Technical White Paper 通过使用数字隔离器替代光耦合器改善系统性能 Koteshwar RaoIsolation Products Appl (Rev. C) | PDF | HTML | 英语版 (Rev.C) | PDF | HTML | 2023年 9月 26日 | |
证书 | CSA Certificate for ISO72xD | 2023年 2月 21日 | ||||
证书 | UL Certificate of Compliance File E181974 Vol 3 Sec 1 | 2022年 8月 8日 | ||||
白皮书 | Why are Digital Isolators Certified to Meet Electrical Equipment Standards? | 2021年 11月 16日 | ||||
用户指南 | 通用数字隔离器评估模块 | PDF | HTML | 英语版 | PDF | HTML | 2021年 9月 28日 | |
白皮书 | 绝缘穿透距离:数字隔离器如何满足认证要求 | 英语版 | PDF | HTML | 2021年 9月 27日 | ||
应用简报 | 如何在标准接口电路中将光耦合器替换为数字隔离器 (Rev. A) | PDF | HTML | 英语版 (Rev.A) | PDF | HTML | 2021年 8月 11日 | |
应用简报 | Considerations for Selecting Digital Isolators | 2018年 7月 24日 | ||||
应用手册 | 所选封装材料的热学和电学性质 | 2008年 10月 16日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
DIGI-ISO-EVM — 通用数字隔离器评估模块
DIGI-ISO-EVM 是一个评估模块 (EVM),用于评估 TI 采用以下五种不同封装的任何单通道、双通道、三通道、四通道或六通道数字隔离器器件:8 引脚窄体 SOIC (D)、8 引脚宽体 SOIC (DWV)、16 引脚宽体 SOIC (DW)、16 引脚超宽体 SOIC (DWW) 和 16 引脚 QSOP (DBQ) 封装。此 EVM 具有足够的 Berg 引脚选项,支持使用超少的外部元件来评估相应器件。
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点