LMH6583
- 16 Inputs and 8 Outputs
- 64-pin Exposed Pad HTQFP Package
- −3 dB Bandwidth (VOUT = 2 VPP, RL = 1 kΩ) 550 MHz
- −3 dB Bandwidth (VOUT = 2 VPP,RL = 150Ω) 450 MHz
- Fast Slew Rate 1800 V/μs
- Channel to Channel Crosstalk (10/ 100 MHz) −70/ −52 dBc
- All Hostile Crosstalk (10/ 100 MHz) −55/−45 dBc
- Easy to Use Serial Programming 4 Wire Bus
- Two Programming Modes Serial & Addressed Modes
- Symmetrical Pinout Facilitates Expansion.
- Output Current ±60 mA
- Gain of 1 Version also Available LMH6582
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The LMH family of products is joined by the LMH6583, a high speed, non-blocking, analog, crosspoint switch. The LMH6583 is designed for high speed, DC coupled, analog signals like high resolution video (UXGA and higher). The LMH6583 has 16 inputs and 8 outputs. The non-blocking architecture allows an output to be connected to any input, including an input that is already selected. With fully buffered inputs the LMH6583 can be impedance matched to nearly any source impedance. The buffered outputs of the LMH6583 can drive up to two back terminated video loads (75Ω load). The outputs and inputs also feature high impedance inactive states allowing high performance input and output expansion for array sizes such as 16 x 16 or 32 x 8 by combining two devices. The LMH6583 is controlled with a 4 pin serial interface. Both single serial mode and addressed chain modes are available.
The LMH6583 comes in a 64-pin thermally enhanced HTQFP package. It also has diagonally symmetrical pin assignments to facilitate double sided board layouts and easy pin connections for expansion.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | LMH6583 16x8 550 MHz Analog Crosspoint Switch, Gain of 2 数据表 (Rev. E) | 2013年 3月 15日 | |||
应用手册 | 选择正确的米6体育平台手机版_好二三四 (TI) 信号开关 (Rev. E) | PDF | HTML | 英语版 (Rev.E) | PDF | HTML | 2022年 8月 5日 | |
应用手册 | 多路复用器和信号开关词汇表 (Rev. B) | 英语版 (Rev.B) | PDF | HTML | 2022年 3月 11日 |
设计和开发
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
HTQFP (PAP) | 64 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点