SN54AS823A
- Functionally Equivalent to AMD's AM29823 and AM29824
- Provide Extra Data Width Necessary for Wider Address/Data Paths or Buses With Parity
- Outputs Have Undershoot-Protection Circuitry
- Power-Up High-Impedance State
- Buffered Control Inputs to Reduce dc Loading Effects
- Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (NT) and Ceramic (JT) 300-mil DIPs
These 9-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. These devices are particularly suitable for implementing wider buffer registers, I/O ports, bidirectional bus drivers, parity bus interfacing, and working registers.
With the clock-enable () input low, the nine D-type edge-triggered flip-flops enter data on the low-to-high transitions of the clock (CLK) input. Taking high disables the clock buffer, latching the outputs. The SN54AS823A and SN74AS823A have noninverting data (D) inputs and the SN74AS824A has inverting (D\) inputs. Taking the clear () input low causes the nine Q outputs to go low independently of the clock.
A buffered output-enable () input can be used to place the nine outputs in either
a normal logic state (high or low logic level) or the high-
impedance state. In the high-impedance state, the outputs neither
load nor drive the bus lines significantly. The high-impedance state
and increased drive provide the capability to drive bus lines without
interface or pullup components.
does not affect the internal operation of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
The SN54AS823A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AS823A and SN74AS824A are characterized for operation from 0°C to 70°C.
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技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | 9-Bit Bus Interface Flip-Flops With 3-State Outputs 数据表 (Rev. A) | 1995年 8月 1日 | |||
* | SMD | SN54AS823A SMD 5962-89525 | 2016年 6月 21日 | |||
应用手册 | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022年 12月 15日 | |||
选择指南 | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||||
应用手册 | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||||
选择指南 | 逻辑器件指南 2014 (Rev. AA) | 最新英语版本 (Rev.AB) | 2014年 11月 17日 | |||
用户指南 | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||||
应用手册 | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||||
应用手册 | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||||
应用手册 | 使用逻辑器件进行设计 (Rev. C) | 1997年 6月 1日 | ||||
应用手册 | Advanced Schottky Load Management | 1997年 2月 1日 | ||||
应用手册 | Input and Output Characteristics of Digital Integrated Circuits | 1996年 10月 1日 | ||||
应用手册 | Live Insertion | 1996年 10月 1日 | ||||
应用手册 | Advanced Schottky (ALS and AS) Logic Families | 1995年 8月 1日 |
设计和开发
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
CDIP (JT) | 24 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点