SN74AUC1G07
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Available in the Texas Instruments NanoFree™ Package
- Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- Ioff Supports Partial Power Down Mode and Back Drive Protection
- Sub-1-V Operable
- Max tpd of 2.5 ns at 1.8 V
- Low Power Consumption, 10-µA Maximum ICC
- ±8-mA Output Drive at 1.8 V
This single buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.
The output of the SN74AUC1G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
For more information about AUC Little Logic devices, see Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, SCEA027.
技术文档
设计和开发
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5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑评估模块
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
DSBGA (YZP) | 5 | Ultra Librarian |
SOT-23 (DBV) | 5 | Ultra Librarian |
SOT-SC70 (DCK) | 5 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点