TL032A
- Direct Upgrades for the TL06x Low-Power BiFETs
- Low Power Consumption . . . 6.5 mW/Channel Typ
- On-Chip Offset-Voltage Trimming for Improved DC Performance (1.5 mV, TL031A)
- Higher Slew Rate and Bandwidth Without Increased Power Consumption
- Available in TSSOP for Small Form-Factor Designs
Excalibur is a trademark of Texas Instruments.
The TL03x series of JFET-input operational amplifiers offer improved dc and ac characteristics over the TL06x family of low-power BiFET operational amplifiers. On-chip zener trimming of offset voltage yields precision grades as low as 1.5 mV (TL031A) for greater accuracy in dc-coupled applications. The Texas Instruments improved BiFET process and optimized designs also yield improved bandwidths and slew rates without increased power consumption. The TL03x devices are pin-compatible with the TL06x and can be used to upgrade existing circuits or for optimal performance in new designs.
BiFET operational amplifiers offer the inherently higher input impedance of the JFET-input transistors without sacrificing the output drive associated with bipolar amplifiers. This higher input impedance makes the TL3x amplifiers better suited for interfacing with high-impedance sensors or very low-level ac signals. These devices also feature inherently better ac response than bipolar or CMOS devices having comparable power consumption.
The TL03x family has been optimized for micropower operation, while improving on the performance of the TL06x series. Designers requiring significantly faster ac response should consider the Excalibur™ TLE206x family of low-power BiFET operational amplifiers.
Because BiFET operational amplifiers are designed for use with dual power supplies, care must be taken to observe common-mode input-voltage limits and output swing when operating from a single supply. DC biasing of the input signal is required, and loads should be terminated to a virtual-ground node at midsupply. The TI TLE2426 integrated virtual-ground generator is useful when operating BiFET amplifiers from single supplies.
The TL03x devices are fully specified at ±15 V and ±5 V. For operation in low-voltage and/or single-supply systems, the TI LinCMOS families of operational amplifiers (TLC prefix) are recommended. When moving from BiFET to CMOS amplifiers, particular attention should be paid to slew rate, bandwidth requirements, and output loading.
The C-suffix devices are characterized for operation from 0°C to 70°C. The I-suffix devices are characterized for operation from –40°C to 85°C. The M-suffix devices are characterized for operation over the full military temperature range of –55°C to 125°C.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | TL03x, TL03xA Enhanced-JFET Low-Power Low-Offset Operational Amplifiers 数据表 (Rev. C) | 2001年 12月 3日 | |||
电子书 | The Signal e-book: 有关运算放大器设计主题的博客文章汇编 | 英语版 | 2018年 1月 31日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
AMP-PDK-EVM — 放大器高性能开发套件评估模块
放大器高性能开发套件 (PDK) 是一款用于测试常见运算放大器参数的评估模块 (EVM) 套件,与大多数运算放大器和比较器均兼容。该 EVM 套件提供了一个主板,主板上具有多个插槽式子卡选项以满足封装需求,使工程师能够快速评估和验证器件性能。
AMP-PDK-EVM 套件支持五种常用的业界通用封装,包括:
- D (SOIC-8)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV(SOT23-5 和 SOT23-6)
- DCK(SC70-5 和 SC70-6)
DIP-ADAPTER-EVM — DIP 适配器评估模块
借助 DIP-Adapter-EVM 加快运算放大器的原型设计和测试,该 EVM 有助于快速轻松地连接小型表面贴装 IC 并且价格低廉。您可以使用随附的 Samtec 端子板连接任何受支持的运算放大器,或者将这些端子板直接连接至现有电路。
DIP-Adapter-EVM 套件支持六种常用的业界通用封装,包括:
- D 和 U (SOIC-8)
- PW (TSSOP-8)
- DGK(MSOP-8、VSSOP-8)
- DBV(SOT23-6、SOT23-5 和 SOT23-3)
- DCK(SC70-6 和 SC70-5)
- DRL (SOT563-6)
DUAL-DIYAMP-EVM — 双通道通用自制 (DIY) 放大器电路评估模块
DUAL-DIYAMP-EVM 系列可实现快速、方便的原型设计,并且使用常用的 0805 或 0603 (...)
ANALOG-ENGINEER-CALC — 模拟工程师计算器
CIRCUIT060013 — 采用 T 网络反馈电路的反相放大器
CIRCUIT060074 — 采用比较器的高侧电流检测电路
PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®
借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短米6体育平台手机版_好二三四上市时间并降低开发成本。
在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
TINA-TI — 基于 SPICE 的模拟仿真程序
TINA-TI 安装需要大约 500MB。直接安装,如果想卸载也很容易。我们相信您肯定会爱不释手。
TINA 是米6体育平台手机版_好二三四 (TI) 专有的 DesignSoft 米6体育平台手机版_好二三四。该免费版本具有完整的功能,但不支持完整版 TINA 所提供的某些其他功能。
如需获取可用 TINA-TI 模型的完整列表,请参阅:SpiceRack - 完整列表
需要 HSpice (...)
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
PDIP (P) | 8 | Ultra Librarian |
SOIC (D) | 8 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点