主页 数据转换器 数模转换器 (DAC) 精密 DAC (≤10MSPS)
主页
数据转换器
数模转换器 (DAC)
精密 DAC (≤10MSPS)

TLV5619

正在供货

12 位单通道并行 DAC，具有电压输出、低功耗和异步更新

立即订购
数据表

可提供此米6体育平台手机版_好二三四的更新版本

open-in-new 比较替代米6体育平台手机版_好二三四
功能与比较器件相似
DAC60501 正在供货 采用 WSON 封装、具有精密内部基准电压的真正 12 位、单通道、SPI/I2C、电压输出 DAC Smaller 2.5mm × 2.5mm package with integrated reference

TLV5619

正在供货
数据表 立即订购

米6体育平台手机版_好二三四详情

Resolution (Bits) 12 Number of DAC channels 1 Interface type Parallel Output type Buffered Voltage Output voltage range (V) 0 to 5.5 INL (max) (±LSB) 4 Settling time (µs) 1 Reference type Ext Architecture String Rating Automotive, Catalog Sample/update rate (Msps) 1 Power consumption (typ) (mW) 4.3 Operating temperature range (°C) -40 to 85 Product type General-purpose DAC
Resolution (Bits) 12 Number of DAC channels 1 Interface type Parallel Output type Buffered Voltage Output voltage range (V) 0 to 5.5 INL (max) (±LSB) 4 Settling time (µs) 1 Reference type Ext Architecture String Rating Automotive, Catalog Sample/update rate (Msps) 1 Power consumption (typ) (mW) 4.3 Operating temperature range (°C) -40 to 85 Product type General-purpose DAC
SOIC (DW) 20 131.84 mm² 12.8 x 10.3 TSSOP (PW) 20 41.6 mm² 6.5 x 6.4
  • Single Supply 2.7-V to 5.5-V Operation
  • ±0.4 LSB Differential Nonlinearity (DNL),
    ±1.5 LSB Integral Nonlinearity (INL)
  • 12-Bit Parallel Interface
  • Compatible With TMS320 DSP
  • Internal Power On Reset
  • Settling Time 1 µs Typ
  • Low Power Consumption:
    • 8 mW for 5-V Supply
    • 4.3 mW for 3-V Supply
  • Reference Input Buffers
  • Voltage Output
  • Monotonic Over Temperature
  • Asynchronous Update
  • APPLICATIONS
    • Battery Powered Test Instruments
    • Digital Offset and Gain Adjustment
    • Battery Operated/Remote Industrial Controls
    • Machine and Motion Control Devices
    • Cordless and Wireless Telephones
    • Speech Synthesis
    • Communication Modulators
    • Arbitrary Waveform Generation
  • Single Supply 2.7-V to 5.5-V Operation
  • ±0.4 LSB Differential Nonlinearity (DNL),
    ±1.5 LSB Integral Nonlinearity (INL)
  • 12-Bit Parallel Interface
  • Compatible With TMS320 DSP
  • Internal Power On Reset
  • Settling Time 1 µs Typ
  • Low Power Consumption:
    • 8 mW for 5-V Supply
    • 4.3 mW for 3-V Supply
  • Reference Input Buffers
  • Voltage Output
  • Monotonic Over Temperature
  • Asynchronous Update
  • APPLICATIONS
    • Battery Powered Test Instruments
    • Digital Offset and Gain Adjustment
    • Battery Operated/Remote Industrial Controls
    • Machine and Motion Control Devices
    • Cordless and Wireless Telephones
    • Speech Synthesis
    • Communication Modulators
    • Arbitrary Waveform Generation

The TLV5619 is a 12-bit voltage output DAC with a microprocessor and TMS320 compatible parallel interface. The 12 data bits are double buffered so that the output can be updated asynchronously using the LDAC\ pin. During normal operation, the device dissipates 8 mW at a 5-V supply and 4.3 mW at a 3-V supply. The power consumption can be lowered to 50 nW by setting the DAC to power-down mode.

The output voltage is buffered by a ×2 gain rail-to-rail amplifier, which features a Class A output stage to improve stability and reduce settling time.

The TLV5619 is a 12-bit voltage output DAC with a microprocessor and TMS320 compatible parallel interface. The 12 data bits are double buffered so that the output can be updated asynchronously using the LDAC\ pin. During normal operation, the device dissipates 8 mW at a 5-V supply and 4.3 mW at a 3-V supply. The power consumption can be lowered to 50 nW by setting the DAC to power-down mode.

The output voltage is buffered by a ×2 gain rail-to-rail amplifier, which features a Class A output stage to improve stability and reduce settling time.
filter 查找其他 精密 DAC (≤10MSPS)
下载

技术文档

star =有关此米6体育平台手机版_好二三四的 TI 精选热门文档
未找到结果。请清除搜索并重试。
查看全部 1
类型 标题 下载最新的英语版本 日期
* 数据表 TLV5619 - 2.7 V To 5.5 V 12-Bit Parallel DAC With Power Down 数据表 (Rev. F) 2004年 2月 29日

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

支持和培训