ホーム パワー・マネージメント AC/DC と DC/DC の各コントローラ (外部 FET)

UCD7242

アクティブ

デジタル、デュアル、同期整流、降圧パワー・ドライバ

製品詳細

Operating temperature range (°C) -40 to 125 Rating Catalog
Operating temperature range (°C) -40 to 125 Rating Catalog
VQFN-HR (RSJ) 32 36 mm² 6 x 6
  • Fully Integrated Power Switches With Drivers
    for Dual Synchronous Buck Converters
  • Full Compatibility With TI Fusion Digital Power Supply
    Controllers, Such as the UCD92xx Family
  • Wide Input Voltage Range: 4.75 V to 18 V
    Operational Down to 2.2 V Input With an External Bias Supply
  • Up to 10A Output Current per Channel
  • Operational to 2 MHz Switching Frequency
  • High Side Current Limit With Current Limit Flag
  • Onboard Regulated 6 V Driver Supply From VIN
  • Thermal Protection
  • Temperature Sense Output – Voltage Proportional to Chip Temperature
  • UVLO and OVLO Circuits Ensure Proper Drive Voltage
  • Rated From –40°C to 125°C Junction Temperature
  • RoHS Compliant
  • Accurate On-Die Current Sensing (±5%)
  • APPLICATIONS
    • Digitally-Controlled Synchronous-Buck Power Stages
    • High Current Dual-Phase VRM/EVRD Regulators for Desktop, Server, Telecom and
      Notebook Processors

  • Fully Integrated Power Switches With Drivers
    for Dual Synchronous Buck Converters
  • Full Compatibility With TI Fusion Digital Power Supply
    Controllers, Such as the UCD92xx Family
  • Wide Input Voltage Range: 4.75 V to 18 V
    Operational Down to 2.2 V Input With an External Bias Supply
  • Up to 10A Output Current per Channel
  • Operational to 2 MHz Switching Frequency
  • High Side Current Limit With Current Limit Flag
  • Onboard Regulated 6 V Driver Supply From VIN
  • Thermal Protection
  • Temperature Sense Output – Voltage Proportional to Chip Temperature
  • UVLO and OVLO Circuits Ensure Proper Drive Voltage
  • Rated From –40°C to 125°C Junction Temperature
  • RoHS Compliant
  • Accurate On-Die Current Sensing (±5%)
  • APPLICATIONS
    • Digitally-Controlled Synchronous-Buck Power Stages
    • High Current Dual-Phase VRM/EVRD Regulators for Desktop, Server, Telecom and
      Notebook Processors

The UCD7242 is a complete power system ready to drive two independent buck power supplies. High side MOSFETs, low side MOSFETs, drivers, current sensing circuitry and necessary protection functions are all integrated into one monolithic solution to facilitate minimum size and maximum efficiency. Driver circuits provide high charge and discharge current for the high-side NMOS switch and the low-side NMOS synchronous rectifier in a synchronous buck circuit. The MOSFET gates are driven to +6.25 V by an internally regulated VGG supply. The internal VGG regulator can be disabled to permit the user to supply an independent gate drive voltage. This flexibility allows a wide power conversion input voltage range of 2.2V to 18V. Internal under voltage lockout (UVLO) logic ensures VGG is good before allowing chip operation.

The synchronous rectifier enable (SRE) pin controls whether or not the low-side MOSFET is turned on when the PWM signal is low. When SRE is high the part operates in continuous conduction mode for all loads. In this mode the drive logic block uses the PWM signal to control both the high-side and low-side gate drive signals. Dead time is also optimized to prevent cross conduction. When SRE is low, the part operates in discontinuous conduction mode at light loads. In this mode the low-side MOSFET is always held off.

On-board comparators monitor the current through the high side switch to safeguard the power stage from sudden high current loads. Blanking delay is set for the high side comparator to avoid false reports coincident with switching edge noise. In the event of an over-current fault, the high-side FET is turned off and the Fault Flag (FLT) is asserted to alert the controller.

MOSFET current is measured and monitored by a precision integrated current sense element. This method provides an accuracy of ±5% over most of the load range. The amplified signal is available for use by the controller on the IMON pin.

An on-chip temperature sense converts the die temperature to a voltage at the TMON pin for the controller’s use. If the die temperature exceeds 170°C, the temperature sensor initiates a thermal shutdown that halts output switching and sets the FLT flag. Normal operation resumes when the die temperature falls below the thermal hysteresis band.

The UCD7242 is a complete power system ready to drive two independent buck power supplies. High side MOSFETs, low side MOSFETs, drivers, current sensing circuitry and necessary protection functions are all integrated into one monolithic solution to facilitate minimum size and maximum efficiency. Driver circuits provide high charge and discharge current for the high-side NMOS switch and the low-side NMOS synchronous rectifier in a synchronous buck circuit. The MOSFET gates are driven to +6.25 V by an internally regulated VGG supply. The internal VGG regulator can be disabled to permit the user to supply an independent gate drive voltage. This flexibility allows a wide power conversion input voltage range of 2.2V to 18V. Internal under voltage lockout (UVLO) logic ensures VGG is good before allowing chip operation.

The synchronous rectifier enable (SRE) pin controls whether or not the low-side MOSFET is turned on when the PWM signal is low. When SRE is high the part operates in continuous conduction mode for all loads. In this mode the drive logic block uses the PWM signal to control both the high-side and low-side gate drive signals. Dead time is also optimized to prevent cross conduction. When SRE is low, the part operates in discontinuous conduction mode at light loads. In this mode the low-side MOSFET is always held off.

On-board comparators monitor the current through the high side switch to safeguard the power stage from sudden high current loads. Blanking delay is set for the high side comparator to avoid false reports coincident with switching edge noise. In the event of an over-current fault, the high-side FET is turned off and the Fault Flag (FLT) is asserted to alert the controller.

MOSFET current is measured and monitored by a precision integrated current sense element. This method provides an accuracy of ±5% over most of the load range. The amplified signal is available for use by the controller on the IMON pin.

An on-chip temperature sense converts the die temperature to a voltage at the TMON pin for the controller’s use. If the die temperature exceeds 170°C, the temperature sensor initiates a thermal shutdown that halts output switching and sets the FLT flag. Normal operation resumes when the die temperature falls below the thermal hysteresis band.

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種類 タイトル 最新の英語版をダウンロード 日付
* データシート Digital Dual Synchronous-Buck Power Driver.. データシート (Rev. B) 2012年 8月 12日
セレクション・ガイド 電源 IC セレクション・ガイド 2018 (Rev. R 翻訳版) 英語版 (Rev.R) 2018年 9月 13日

設計および開発

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アプリケーション・ソフトウェアとフレームワーク

FUSION_DIGITAL_POWER_DESIGNER — デジタル電源用ソフトウェア

Fusion Digital Power™ は、TI のデジタル電源コントローラとシーケンサ / ヘルス・モニタの構成および監視を行うためのグラフィカル・ユーザー・インターフェイス (GUI) ソフトウェアです。アプリケーションは PMBus プロトコルを使用し、TI の USB アダプタとシリアル・バス経由でデバイスとの通信を行います。
アプリケーション・ソフトウェアとフレームワーク

FUSION_MFR_GUI — Fusion Digital Power 作成ツール

The Fusion Digital Power Manufacturing Tool (aka MFR GUI) is a Graphical User Interface used to download firmware, upgrade firmware, configure, calibrate and test .

The MFR GUI supports the same devices as Fusion Digital Power Designer software.  This tool is typically used in manufacturing (...)


リファレンス・デザイン

TIDEP0036 — 効率的な OPUS コーデック・ソリューションを実施する TMS320C6657 を使用したリファレンス・デザイン

The TIDEP0036 reference design provides an example of the ease of running TI optimized Opus encoder/decoder on the TMS320C6657 device. Since Opus supports a a wide range of bit rates, frame sizes and sampling rates, all with low delay, it has applicability for voice communications, networked audio (...)
設計ガイド: PDF
回路図: PDF
パッケージ ピン数 CAD シンボル、フットプリント、および 3D モデル
VQFN-HR (RSJ) 32 Ultra Librarian

購入と品質

記載されている情報:
  • RoHS
  • REACH
  • デバイスのマーキング
  • リード端子の仕上げ / ボールの原材料
  • MSL 定格 / ピーク リフロー
  • MTBF/FIT 推定値
  • 使用原材料
  • 認定試験結果
  • 継続的な信頼性モニタ試験結果
記載されている情報:
  • ファブの拠点
  • 組み立てを実施した拠点

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