CC2564CMSP432BTBLESW

CC2564C TI Dual-mode Bluetooth® Stack on MSP432 MCUs

CC2564CMSP432BTBLESW

Downloads

Overview

TI’s CC2564C Dual-mode Bluetooth® stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 5.1 specification. The Bluetooth stack is fully qualified (QDID172096 and QDID172097), provides simple command line based sample applications to speed development, and upon request has MFI capability.

For a complete evaluation solution, the CC2564C Dual-mode Bluetooth stack works directly with the TI hardware development kits: MSP-EXP432P401R, BOOST-CCEMADAPTER and CC256XCQFN-EM. For audio and voice applications, the CC3200AUDBOOST can be connected to the MSP-EXP432P401R and BOOST-CCEMADAPTER. Moreover, the stack that is available for the MSP432 MCU is certified and royalty-free.

The software works with the CC256XCQFN-EM board via the BOOST-CCEMADAPTER and MSP-EXP432P401R boards which provides a complete Bluetooth BT/EDR/LE HCI solution, reducing design effort and enabling fast time to market.

Features
  • Supports Dual-mode Bluetooth 5.1 - Bluetooth certified and royalty free
  • Supports LE Secure Connection
  • Supports LE Dual Mode Topology and Link Layer Topology with CC2564C
  • Bluetooth stack is fully qualified (QDID172096 and QDID172097)
  • Fully Thread safe
  • Sample apps are available for the MSP-EXP432P401R LaunchPad with the support of the BOOST-CCEMADAPTER
  • Fully Documented API Interface
  • Supports CCS, IAR, KEIL IDE
  • Classic Profiles Available
    • Advanced Audio Distribution Profile (A2DP): Internal SBC encoding/decoding is implemented (Assisted A2DP) – please note that due to lack of PCM routing in MSP Launchpad, manual prototyping is required to interface an external audio codec EVM, e.g. CC3200AUDBOOST
    • Audio/Video Transport Protocols (AVDTP)
    • Audio/Video Remote Control Profile (AVRCP)
    • Generic Access Profile (GAP)
    • Headset Profile (HSP) and Hands Free Profile (HFP): please note that due to lack of PCM routing in MSP Launchpad, manual prototyping is required to interface an external audio codec EVM, e.g. CC3200AUDBOOST
    • Human Interface Device Profile (HID)
    • Message Access Profile (MAP)
    • Phonebook Access Profile (PBAP)
    • Serial Port Profile (SPP)
  • Bluetooth Low Energy Profiles Available
    • Alert Notification Service (ANS)
    • Battery Service (BAS)
    • Cycle Speed and Cadence Service (CSCS)
    • Device Information Service (DIS)
    • Find Me Profile (FMP)
    • Generic Access Profile Service (GAPS)
    • Generic Attribute Profile (GATT)
    • Health Thermometer Service (HTS)
    • Heart Rate Service (HRS)
    • Human Interface Device Service (HIDS)
    • Immediate Alert Service (IAS)
    • Link Loss Service (LLS)
    • Phone Alert State Service (PASS)
    • Proximity Profile (PXP)
    • TX Power Service (TPS)
Download View video with transcript Video

Downloads

Driver or library

CC2564CMSP432BTBLESW1 CC2564C TI Dual-mode Bluetooth® Stack on MSP432 MCUs

lock = Requires export approval (1 minute)
Supported products & hardware

Supported products & hardware

Wi-Fi products
CC2564C Bluetooth® 5.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE)
Interface adapter
BOOST-CCEMADAPTER EM Adapter BoosterPack

Technical documentation

No results found. Please clear your search and try again.
View all 5
Type Title Date
More literature Dual-Mode Bluetooth® CC256xCQFNEM Evaluation Board (Rev. C) PDF | HTML 20 Dec 2021
User guide CC2564C TI Dual-mode Bluetooth Stack on MSP432 MCUs (Rev. B) PDF | HTML 20 Dec 2021
User guide CC2564B to CC2564C Migration Guide (Rev. B) PDF | HTML 01 Dec 2021
User guide CC256xC QFN EM User Guide (Rev. B) 11 Mar 2020
User guide EM Adapter BoosterPack User's Guide (Rev. A) 15 Apr 2013

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support.

Videos