TI does not offer ongoing direct design support for this hardware. For support while working through your design, contact In-Vision Digital Imaging Optics GmbH.
INV-3P-HELIOS-S
In-Vision Helios S ("Superpeak") reaches up to 16W output power using a DLP9000 chipset
INV-3P-HELIOS-S
Overview
HELIOS S ("Superpeak) Light Engine using the DLP9000 Chipset from TI is able to increase the already high performance even more. While the standard version achieves 12W peak power in the image plane, HELIOS S reaches up to 16W. This value is essential when it comes to working with resins, which demand high power or exposure to large areas. Even at a pixel size of 160um, the peak intensity reaches over 15mW/cm2. Application areas: 3D Printing, Lithography, Bioengineering and other industrial and scientific applications.
Features
- DLP9000X chipset
- 2560 x 1600 Micromirror array size
- 365, 385 and 405nm Wavelengths (LED)
- 6 | 31 | 75 | 100 | 150 | 162µ Standard lenses (others on request)
- Up to 16W (wavelength-dependent) Optical output power
- LED interchangeability
- Integrated intensity module for stable high intensity
- Up to 1:300 ANSI contrast ratio
- Up to 95% acc. to IEC61947 (Lens dependent) uniformity
Photos courtesy of In-Vision Digital Imaging Optics GmbH
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Optical module
INVISION-HELIOS-S
— In-Vision Helios S - High-power light engine using DLP9000X
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