TI does not offer ongoing direct design support for this hardware. For support while working through your design, contact In-Vision Digital Imaging Optics GmbH.
INV-3P-PANDIA
Overview
The PANDIA high-performance system based on DLP9000X offers, due to programmability, extended adjustment options, more power, up to 4K native resolution and the highest reliability for industrial use. And not enough about that: The all-new light engine is designed for dynamic exposure with multiple wavelengths. Application areas: 3D Printing, Lithography, Bioengineering and other industrial and scientific applications.
Features
- DLP9000X or 991U or each in UV version chipset
- Scrolling availability for larger building areas
- Stackability for more productivity
- Built-in FPGA allows users to customize their applications or use prepared software
- Multiple wavelengths for working with multi-materials
- Telecentric lens with a pixel size of 10um (any other resolutions can be easily realized)
- Watercooled system for highest optical power
- High-Speed Data Interface (Ethernet, PCIe as option)
- Field changeability of the illumination modules
- Onboard User-Interface for operators
Photos courtesy of In-Vision Digital Imaging Optics GmbH
Order & start development
Optical module
INVISION-PANDIA
— In-Vision PANDIA - The next big step in PCB-lithography, advanced packaging and advanced additive manufacturing
Support & training
Video series
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