The HEATEVM is a MCM intended to provide a high temperature platform for signal conditioning and processor evaluation. The module consists of a complete chain of components designed to withstand extreme operating temperatures up to 200 °C. The PCB is made with polymide material also suited for these extreme temperatures.
A fully assembled board has been developed for testing and performance validation only, and is not available for sale.
Download ready-to-use system files to speed your design process.
Test results for the reference design, including efficiency graphs, test prerequisites and more
Detailed schematic diagram for design layout and components
Complete listing of design components, reference designators, and manufacturers/part numbers
Design file that contains information on physical board layer of design PCB
Includes TI products in the design and potential alternatives.
| Type | Title | Date | ||
|---|---|---|---|---|
| Test report | TIDA-00002 Test Results | Sep. 17, 2013 |
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.