This reference design gives an example implementation of an IO-Link device interface. The design includes the IO-Link device physical layer (PHY) including a low-dropout (LDO) as well as a low-power microcontroller. This combination supports IO-Link COM3 transfer rate and a cycle time of 400μs. The MSPM0 microcontroller integrates an internal oscillator, so the MCU is able to run this application without the need of an external crystal, saving cost and space.
A fully assembled board has been developed for testing and performance validation only, and is not available for sale.
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Reference design overview and verified performance test data
Includes TI products in the design and potential alternatives.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Design guide | IO-Link device implementation for sensors and actuator reference design (Rev. A) | PDF | HTML | Jun. 05, 2024 |
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