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TMDS64DC01EVM

AM64x IO-link and high-speed breakout card

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TMDS64DC01EVM

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Overview

The AM64x IO-Link and high speed expansion board is an add-on module for the AM64x GP EVM.  This board includes eight (8) IO-Link ports and general purpose signal breakout.  The Breakout board section provides the test access to all the IO signals included on the High Speed Expansion connector from AM64x EVM. 

This design helps build a universal and scalable IO-Link master. This IO link board/breakout board shall have 150 pin HSE connector and 20 pin ADC connector to mate with General Processor EVM board and eight M12 connectors to execute IO-Link functionality.

Features
  • Provides access to all signals on AM64x GP EVM HSE connector
  • x8 M12 IO-Link ports with fault protection
  • Precision current monitoring with onboard INA253
  • x16 individually addressable LEDs

  • Assembled HSE IO-link expansion board
Not included
Arm-based processors
AM6411 — Single-core 64-bit Arm® Cortex®-A53, single-core Cortex-R5F, PCIe, USB 3.0 and security AM6412 — Dual-core 64-bit Arm® Cortex®-A53, single-core Cortex-R5F, PCIe, USB 3.0 and security AM6421 — Single-core 64-bit Arm® Cortex®-A53, dual-core Cortex-R5F, PCIe, USB 3.0 and security AM6422 — Dual-core 64-bit Arm® Cortex®-A53, dual-core Cortex-R5F, PCIe, USB 3.0 and security AM6441 — Single-core 64-bit Arm® Cortex®-A53, quad-core Cortex-R5F, PCIe, USB 3.0 and security AM6442 — Dual-core 64-bit Arm® Cortex®-A53, quad-core Cortex-R5F, PCIe, USB 3.0 and security

 

Arm Cortex-R MCUs
AM2431 — Arm® Cortex®-R5F-based MCU with industrial communications and security up to 800 MHz AM2432 — Dual-core Arm® Cortex®-R5F-based MCU with industrial communications and security up to 800 MHz AM2434 — Quad-core Arm® Cortex®-R5F-based MCU with industrial communications and security up to 800 MHz
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Important note

TMDS64DC01EVM is a prototype evaluation module and is available in limited quantities.

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TMDS64DC01EVM — AM64x IO-link and high-speed breakout card

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Design tool

SPRR457 — TMDS64DC01EVM Design File Package

Supported products & hardware
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SPRR457 — TMDS64DC01EVM Design File Package

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Latest version
Version: 01.00.00.00
Release date: 13 Jun 2022
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download TMDS64DC01EVM Design File Package (zip)  — 15140 K

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Hardware development
Evaluation board
TMDS64DC01EVM — AM64x IO-link and high-speed breakout card

Release Infomation

The design resource accessed as www.ti.com/lit/zip/sprr457 or www.ti.com/lit/xx/sprr457/sprr457.zip has been migrated to a new user experience at www.ti.com/tool/download/SPRR457. Please update any bookmarks accordingly.
TI's Standard Terms and Conditions for Evaluation Items apply.

Technical documentation

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Type Title Date
* User guide TMDS64DC01EVM User's Guide PDF | HTML 26 Oct 2021
Certificate TMDS64DC01EVM EU RoHS Declaration of Conformity (DoC) 23 Mar 2021

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Software development

SOFTWARE DEVELOPMENT KIT (SDK)
PROCESSOR-SDK-AM64X — Software development kit for AM64x Sitara™ processors

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