LP-EM-CC1312PSIP
适用于 SimpleLink™ Sub-1GHz 无线 MCU 的 CC1312PSIP LaunchPad™ 开发套件
LP-EM-CC1312PSIP
概述
此 LaunchPad™ 开发套件适用于 CC1312PSIP 射频系统级封装 (SIP) 模块。该射频模块具有集成功率放大器，可在 Sub-1GHz 下运行，功率高达 +20dBm。支持的协议包括 mioty、Wi-SUN®、TI 15.4 stack 和 SimpleLink™ 低功耗 F2 SDK 中提供的 Sub-1GHz 专有射频协议。这是一个分离式 LaunchPad 开发套件，意味着不包含 XDS 调试器。推荐使用 LP-XDS110 或 LP-XDS110ET 调试器。
特性
- 具有 Sub-1GHz 无线电的 LaunchPad 开发套件，适用于带有集成型 PCB 迹线天线的无线应用。
- 展示小型预认证 RF SIP 模块的快速原型设计可节省认证和测试时间。
- 开发人员需要单独购买用于软件开发和射频评估的调试器（LP-XDS110 或 LP-XDS110ET）。
- 此开发套件与 TI BoosterPack 生态系统和更多硬件组件兼容，可扩展功能以适合您的设计。
Sub-1GHz 无线 MCU
立即订购并开发
LP-EM-CC1312PSIP — CC1312PSIP LaunchPad™ development kit for SimpleLink Sub-1GHz wireless MCU
SIMPLELINK-ACADEMY-CC13XX-CC26XX — SimpleLink™ CC13xx and CC26xx Academy
SIMPLELINK-ACADEMY-CC13XX-CC26XX — SimpleLink™ CC13xx and CC26xx Academy
米6体育平台手机版_好二三四
汽车类无线连接米6体育平台手机版_好二三四
低功耗 2.4GHz 米6体育平台手机版_好二三四
Sub-1GHz 无线 MCU
硬件开发
开发套件
评估板
发布信息
Initial release of the SimpleLink CC13xx CC26xx Academy
SIMPLELINK-LOWPOWER-F2-SDK — SimpleLink™ Low Power F2 software development kit (SDK) for the CC13x1, CC13x2, CC13x4, CC26x1, CC26x2 and CC26x4 devices
SIMPLELINK-LOWPOWER-F2-SDK — SimpleLink™ Low Power F2 software development kit (SDK) for the CC13x1, CC13x2, CC13x4, CC26x1, CC26x2 and CC26x4 devices
米6体育平台手机版_好二三四
低功耗 2.4GHz 米6体育平台手机版_好二三四
Sub-1GHz 无线 MCU
汽车类无线连接米6体育平台手机版_好二三四
硬件开发
评估板
开发套件
发布信息
The SimpleLink™ Low Power F2 Software Development Kit (SDK), formerly known as the CC13xx and CC26xx SDK, delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC13xx and CC26xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC13xx and CC26xx wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth 5.2, Zigbee 3.0 compliant protocol suite, RF-Proprietary examples, TI's 15.4 Stack, TI Wi-SUN FAN Stack, Amazon Sidewalk examples, as well as the TI-RTOS7 kernel and TI Drivers in one easy-to-use software package along with example applications and documentation. In addition, the Dynamic Multi-Protocol Manager (DMM) software component enables multiprotocol development on a single SimpleLink wireless MCU.
Although not included in the SDK, SimpleLink CC13xx and CC26xx wireless MCUs are also capable of supporting the following wireless solutions: Please refer to their respective repositories for resources and more information.
- The Matter standard: https://github.com/TexasInstruments/matter
- Thread 1.1.1 networking stack based on OpenThread: (https://github.com/TexasInstruments/ot-ti)
The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.
This SDK is also available on GitHub at https://github.com/TexasInstruments/simplelink-lowpower-f2-sdk
最新信息
- The Wireless Solar Management System (WSMS) examples showcase a small mesh network with low latency.
- TI Wi-SUN FAN Stack can keep track of minimum tx off time and duty cycle, simplifying certification with ARIB and ETSI.
- TI 15.4-Stack example PHY is configurable with the Custom PHY option in SysConfig. This opens the option to use WB-DSSS with TI 15.4-Stack.
- RF settings update for CC13x4/CC26x4 devices
技术文档
| 类型 | 标题 | 下载最新的英文版本 | 日期 | |||
|---|---|---|---|---|---|---|
| 证书 | LP-EM-CC1312PSIP EU Declaration of Conformity (DoC) | 2023年 12月 1日 | ||||
| 更多文献资料 | LP-EM-CC1312PSIP Quick Start Guide | 2023年 11月 7日 | ||||
| 应用手册 | TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) | 2017年 2月 28日 |