QFN16-DIP-EVM
16 引脚 QFN 到 DIP 适配器评估模块
QFN16-DIP-EVM
概述
The QFN16-DIP-EVM provides a fast and easy platform for prototyping TI's RUM16 package parts. This tool is targeted especially for TI's Quad OpAmps, but may be used with any device with the same footprint. Scoring allows each device to be separated into individual circuit boards. With included terminal strips, boards may be plugged into DIP type sockets or solderless breadboards.
特性
- Low cost
- Flexible design allows use with any pinout
- Protoype up to 8 devices with one EVM
- Compatible with common solderless breadboards
- QFN16-DIP-EVM Circuit Board
- (2)Terminal Strip Samtec TS-132-G-AA
精密运算放大器 (Vos<1mV)
技术文档
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| 类型 | 标题 | 下载最新的英文版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | EVM 用户指南 | Using the QFN16-DIP-EVM evaluation module | 2019年 2月 20日 | |||
| 证书 | QFN16-DIP-EVM EU Declaration of Conformity (DoC) | 2019年 2月 5日 |