TQ-3P-SOM-TQMA62XX

TQ-Group TQMa62xx system on modules for AM623 and AM625 Arm Cortex-A53 1.4-GHz processors

TQ-3P-SOM-TQMA62XX

来自 : TQ-Group
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概述

The embedded module TQMa62xx, is based on the processor family AM623 and AM625 processor family. This module is designed to use the pin-compatible processors on one module design. This module is ideal for applications that require advanced computing power and scalable graphics performance. The AM62x family is introduced as the successor to the AM335x family of general purpose processors.

This MPU family offers performance enhancements in graphics, computing power and a variety of industrial interfaces. The modules make peripherals, including 2x TSN-capable Gb Ethernet switches, USB 2.0, CAN-FD, UART, LVDS, Parallel RGB, and CSI, available for the designer without complex power and high-speed data routing such as DDR.

特性
  • 38 mm x 55 mm HDI module, 38 mm x 38 mm LGA module
  • 320-pins, 0.5mm (HDI), 366-pin ball array (LGA)
  • 2-GB LPDDR4 with ECC, 64-GB eMMC, 256-MB NOR Flash
  • 2x Gb Ethernet switch (TSN), 3x CAN-FD, 2x USB 2.0
  • LVDS + Parallel RGB dual-display
  • Low power consumption (typ. 2W), integrated security functions
基于 Arm 的处理器
AM623 具有基于 Arm® Cortex®-A53 的对象和手势识别功能的物联网 (IoT) 和网关 SoC AM625 具有基于 Arm® Cortex®-A53 的边缘 AI 和全高清双显示的人机交互 SoC
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开发套件

STKa62xx — Evaluation and development kit for TQMa62xx

开发套件

STKa62xxL — Evaluation and development kit for TQMa62xxL

评估板

TQMA62XXL — System on module in land-grid array (LGA) solder-down form factor, based on AM623 and AM625 processors

评估板

TQMA62XX — System on module with high density interconnects (HDI), based on AM623 and AM625 processors

应遵守 TI 的评估模块标准条款与条件.

支持与培训

第三方支持
TI 不会为此硬件提供持续且直接的设计支持。要在设计期间获得支持,请联系 TQ-Group.

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免责声明

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