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SIMPLELINK-LOWPOWER-F3-SDK

SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx devices

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最新版本
版本: 8.10.01.02
发布日期: 06 六月 2024
米6体育平台手机版_好二三四
低功耗 2.4GHz 米6体育平台手机版_好二三四
CC2340R5 具有 512kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M0+ 低功耗 Bluetooth® 无线 MCU CC2340R2 具有 256kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M0+ 低功耗 Bluetooth® 无线 MCU
汽车类无线连接米6体育平台手机版_好二三四
CC2340R5-Q1 具有 512kB 闪存、符合汽车标准的 SimpleLink™ 低功耗 Bluetooth® 无线 MCU
硬件开发
评估板
LP-EM-CC2340R5 CC2340R5 SimpleLink™ 低功耗 Bluetooth® 5.3 MCU LaunchPad™ 开发套件

发布信息

The SimpleLink™ Low Power F3 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC23xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC23xx wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth, Proprietary RF examples, and TI Drivers in one easy-to-use software package along with example applications and documentation.

The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.

Features:

  • Industry leading Bluetooth Low Energy (BLE) software protocol stack supporting Bluetooth 5.3 (learn more at TI.com/ble)
  • Support for Proprietary 2.4 GHz applications supporting basic RX and TX examples

最新动态

  • This point release implements minor bugfixes & limited changes.