ZHCSPP4A june   2022  – july 2023 ADC12QJ1600-SP

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. 说明(续)
  6. Revision History
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: DC Specifications
    6. 7.6  Electrical Characteristics: Power Consumption
    7. 7.7  Electrical Characteristics: AC Specifications
    8. 7.8  Switching Characteristics
    9. 7.9  Timing Requirements
    10. 7.10 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
        1. 8.3.1.1 Analog Input Protection
        2. 8.3.1.2 Full-Scale Voltage (VFS) Adjustment
        3. 8.3.1.3 Analog Input Offset Adjust
        4. 8.3.1.4 ADC Core
          1. 8.3.1.4.1 ADC Theory of Operation
          2. 8.3.1.4.2 ADC Core Calibration
          3. 8.3.1.4.3 Analog Reference Voltage
          4. 8.3.1.4.4 ADC Over-range Detection
          5. 8.3.1.4.5 Code Error Rate (CER)
      2. 8.3.2 Temperature Monitoring Diode
      3. 8.3.3 Timestamp
      4. 8.3.4 Clocking
        1. 8.3.4.1 Converter PLL (C-PLL) for Sampling Clock Generation
        2. 8.3.4.2 LVDS Clock Outputs (PLLREFO±, TRIGOUT±)
        3. 8.3.4.3 Optional CMOS Clock Outputs (ORC, ORD)
        4. 8.3.4.4 SYSREF for JESD204C Subclass-1 Deterministic Latency
          1. 8.3.4.4.1 SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
          2. 8.3.4.4.2 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
      5. 8.3.5 JESD204C Interface
        1. 8.3.5.1  Transport Layer
        2. 8.3.5.2  Scrambler
        3. 8.3.5.3  Link Layer
        4. 8.3.5.4  8B or 10B Link Layer
          1. 8.3.5.4.1 Data Encoding (8B or 10B)
          2. 8.3.5.4.2 Multiiframes and the Local Multiframe Clock (LMFC)
          3. 8.3.5.4.3 Code Group Synchronization (CGS)
          4. 8.3.5.4.4 Initial Lane Alignment Sequence (ILAS)
          5. 8.3.5.4.5 Frame and Multiframe Monitoring
        5. 8.3.5.5  64B or 66B Link Layer
          1. 8.3.5.5.1 64B or 66B Encoding
          2. 8.3.5.5.2 Multiblocks, Extended Multiblocks and the Local Extended Multiblock Clock (LEMC)
            1. 8.3.5.5.2.1 Block, Multiblock and Extended Multiblock Alignment using Sync Header
              1. 8.3.5.5.2.1.1 Cyclic Redundancy Check (CRC) Mode
              2. 8.3.5.5.2.1.2 Forward Error Correction (FEC) Mode
          3. 8.3.5.5.3 Initial Lane Alignment
          4. 8.3.5.5.4 Block, Multiblock and Extended Multiblock Alignment Monitoring
        6. 8.3.5.6  Physical Layer
          1. 8.3.5.6.1 SerDes Pre-Emphasis
        7. 8.3.5.7  JESD204C Enable
        8. 8.3.5.8  Multi-Device Synchronization and Deterministic Latency
        9. 8.3.5.9  Operation in Subclass 0 Systems
        10. 8.3.5.10 Alarm Monitoring
          1. 8.3.5.10.1 Clock Upset Detection
          2. 8.3.5.10.2 FIFO Upset Detection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Low Power Mode and High Performance Mode
      2. 8.4.2 JESD204C Modes
        1. 8.4.2.1 JESD204C Transport Layer Data Formats
        2. 8.4.2.2 64B or 66B Sync Header Stream Configuration
        3. 8.4.2.3 Redundant Data Mode (Alternate Lanes)
      3. 8.4.3 Power-Down Modes
      4. 8.4.4 Test Modes
        1. 8.4.4.1 Serializer Test-Mode Details
        2. 8.4.4.2 PRBS Test Modes
        3. 8.4.4.3 Clock Pattern Mode
        4. 8.4.4.4 Ramp Test Mode
        5. 8.4.4.5 Short and Long Transport Test Mode
          1. 8.4.4.5.1 Short Transport Test Pattern
        6. 8.4.4.6 D21.5 Test Mode
        7. 8.4.4.7 K28.5 Test Mode
        8. 8.4.4.8 Repeated ILA Test Mode
        9. 8.4.4.9 Modified RPAT Test Mode
      5. 8.4.5 Calibration Modes and Trimming
        1. 8.4.5.1 Foreground Calibration Mode
        2. 8.4.5.2 Background Calibration Mode
        3. 8.4.5.3 Low-Power Background Calibration (LPBG) Mode
      6. 8.4.6 Offset Calibration
      7. 8.4.7 Trimming
    5. 8.5 Programming
      1. 8.5.1 Using the Serial Interface
      2. 8.5.2 SCS
      3. 8.5.3 SCLK
      4. 8.5.4 SDI
      5. 8.5.5 SDO
      6. 8.5.6 Streaming Mode
      7. 8.5.7 SPI_Register_Map Registers
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Light Detection and Ranging (LiDAR) Digitizer
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Analog Front-End Requirements
          2. 9.2.1.2.2 Calculating Clock and SerDes Frequencies
        3. 9.2.1.3 Application Curves
    3. 9.3 Initialization Set Up
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Power Sequencing
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ALR|144
散热焊盘机械数据 (封装 | 引脚)
订购信息

Transport Layer

The transport layer takes samples from the ADC output and maps the samples into octets inside of frames. These frames are then mapped onto the available lanes. The mapping of octets into frames and frames onto lanes is defined by the transport layer settings such as L, M, F, S, N and N'. An octet is 8 bits (before 8B/10B or 64B/66B encoding), a frame consists of F octets and the frames are mapped onto L lanes. Samples are N bits, but sent as N' bits across the link. The samples come from M converters and there are S samples per converter per frame cycle. M is sometimes artificially increased in order to obtain a more desirable mapping, for instance lower latency may be achieved with a larger M value for long frames.

There are a number of predefined transport layer modes in the device that are defined in Table 8-15. The high level configuration parameters for the transport layer in the device are described in Table 8-13. The transport layer mode is chosen by simply setting the JMODE register setting. For reference, the various configuration parameters for JESD204C are defined in Table 8-14.

The link layer further maps the frames into multiframes when using 8B/10B encoding or blocks, multiblocks and extended multiblocks when using 64B/66B encoding.