ZHCSJY1A June   2019  – January 2021 ADS125H01

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Diagrams
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input Voltage Range
      2. 9.3.2 Analog Inputs (AINP, AINN)
        1. 9.3.2.1 ESD Diodes
        2. 9.3.2.2 Input Switch
      3. 9.3.3 Programmable Gain Amplifier (PGA)
        1. 9.3.3.1 PGA Operating Range
        2. 9.3.3.2 PGA Monitors
      4. 9.3.4 Reference Voltage
        1. 9.3.4.1 Reference Monitor
      5. 9.3.5 ADC Modulator
      6. 9.3.6 Digital Filter
        1. 9.3.6.1 Sinc Filter Mode
          1. 9.3.6.1.1 Sinc Filter Frequency Response
        2. 9.3.6.2 FIR Filter
        3. 9.3.6.3 50-Hz and 60-Hz Normal-Mode Rejection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Conversion Control
        1. 9.4.1.1 Continuous-Conversion Mode
        2. 9.4.1.2 Pulse-Conversion Mode
        3. 9.4.1.3 Conversion Latency
        4. 9.4.1.4 Start-Conversion Delay
      2. 9.4.2 Clock Mode
      3. 9.4.3 Reset
        1. 9.4.3.1 Power-On Reset
        2. 9.4.3.2 Reset by RESETPin
        3. 9.4.3.3 Reset by Command
      4. 9.4.4 Calibration
        1. 9.4.4.1 Offset and Full-Scale Calibration
          1. 9.4.4.1.1 Offset Calibration Registers
          2. 9.4.4.1.2 Full-Scale Calibration Registers
        2. 9.4.4.2 Offset Calibration Command (OFSCAL)
        3. 9.4.4.3 Full-Scale Calibration Command (GANCAL)
        4. 9.4.4.4 Calibration Command Procedure
        5. 9.4.4.5 User Calibration Procedure
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Chip-Select Pins (CS1 and CS2)
        2. 9.5.1.2 Serial Clock (SCLK)
        3. 9.5.1.3 Data Input (DIN)
        4. 9.5.1.4 Data Output/Data Ready (DOUT/DRDY)
      2. 9.5.2 Data Ready (DRDY)
        1. 9.5.2.1 DRDY in Continuous-Conversion Mode
        2. 9.5.2.2 DRDY in Pulse-Conversion Mode
        3. 9.5.2.3 Data Ready by Software Polling
      3. 9.5.3 Conversion Data
        1. 9.5.3.1 Status Byte (STATUS0)
        2. 9.5.3.2 Conversion Data Format
      4. 9.5.4 Cyclic Redundancy Check (CRC)
      5. 9.5.5 Commands
        1. 9.5.5.1  General Command Format
        2. 9.5.5.2  NOP Command
        3. 9.5.5.3  RESET Command
        4. 9.5.5.4  START Command
        5. 9.5.5.5  STOP Command
        6. 9.5.5.6  RDATA Command
        7. 9.5.5.7  OFSCAL Command
        8. 9.5.5.8  GANCAL Command
        9. 9.5.5.9  RREG Command
        10. 9.5.5.10 WREG Command
    6. 9.6 Register Map
      1. 9.6.1  Device Identification (ID) Register (address = 00h) [reset = 4xh]
      2. 9.6.2  Main Status (STATUS0) Register (address = 01h) [reset = 01h]
      3. 9.6.3  Mode 0 (MODE0) Register (address = 02h) [reset = 24h]
      4. 9.6.4  Mode 1 (MODE1) Register (address = 03h) [reset = 01h]
      5. 9.6.5  Reserved (RESERVED) Register (address = 04h) [reset = 00h]
      6. 9.6.6  Mode 3 (MODE3) Register (address = 05h) [reset = 00h]
      7. 9.6.7  Reference Configuration (REF) Register (address = 06h) [reset = 05h]
      8. 9.6.8  Offset Calibration (OFCALx) Registers (address = 07h, 08h, 09h) [reset = 00h, 00h, 00h]
      9. 9.6.9  Full-Scale Calibration (FSCALx) Registers (address = 0Ah, 0Bh, 0Ch) [reset = 00h, 00h, 40h]
      10. 9.6.10 Reserved (RESERVED) Register (address = 0Dh) [reset = FFh]
      11. 9.6.11 Reserved (RESERVED) Register (address = 0Eh) [reset = 00h]
      12. 9.6.12 Reserved (RESERVED) Register (address = 0Fh) [reset = 00h]
      13. 9.6.13 MODE4 (MODE4) Register (address = 10h) [reset = 50h]
      14. 9.6.14 PGA Alarm (STATUS1) Register (address = 11h) [reset = xxh]
      15. 9.6.15 Status 2 (STATUS2) Register (address = 12h) [reset = 0xh]
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Example to Determine the PGA Linear Operating Range
      2. 10.1.2 Input Signal Rate of Change (dV/dt)
      3. 10.1.3 Unused Inputs and Outputs
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Decoupling
    2. 11.2 Analog Power-Supply Clamp
    3. 11.3 Power-Supply Sequencing
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 静电放电警告
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)±2000V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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