ZHCSCL7C May   2014  – April 2021 AFE4403

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Family Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Requirements: Supply Ramp and Power-Down
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Receiver Channel
        1. 8.3.1.1 Receiver Front-End
        2. 8.3.1.2 Ambient Cancellation Scheme and Second Stage Gain Block
        3. 8.3.1.3 Receiver Control Signals
        4. 8.3.1.4 Receiver Timing
      2. 8.3.2 Clocking and Timing Signal Generation
      3. 8.3.3 Timer Module
        1. 8.3.3.1 Using the Timer Module
      4. 8.3.4 Receiver Subsystem Power Path
      5. 8.3.5 Transmit Section
        1. 8.3.5.1 Third LED Support
        2. 8.3.5.2 Transmitter Power Path
        3. 8.3.5.3 LED Power Reduction During Periods of Inactivity
        4. 8.3.5.4 LED Configurations
    4. 8.4 Device Functional Modes
      1. 8.4.1 ADC Operation and Averaging Module
        1. 8.4.1.1 Operation Without Averaging
        2. 8.4.1.2 Operation With Averaging
        3. 8.4.1.3 Dynamic Power-Down Mode
      2. 8.4.2 Diagnostics
        1. 8.4.2.1 Photodiode-Side Fault Detection
        2. 8.4.2.2 Transmitter-Side Fault Detection
        3. 8.4.2.3 Diagnostics Module
    5. 8.5 Programming
      1. 8.5.1 Serial Programming Interface
      2. 8.5.2 Reading and Writing Data
        1. 8.5.2.1 Writing Data
        2. 8.5.2.2 Reading Data
        3. 8.5.2.3 Multiple Data Reads and Writes
        4. 8.5.2.4 Register Initialization
        5. 8.5.2.5 AFE SPI Interface Design Considerations
    6. 8.6 Register Maps
      1. 8.6.1 AFE Register Map
      2. 8.6.2 AFE Register Description
  9. Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Consumption Considerations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Operation Without Averaging

In this mode, the ADC outputs a digital sample one time for every 50 µs. Consider a case where the ADC Reset signals are positioned at 25%, 50%, 75%, and 100% (or 0%) points in the pulse repetition period. At each rising edge of the ADC reset signal, one ADC conversion value is written into the result registers sequentially as follows (see Figure 8-28):

  • At the 25% reset signal, the first ADC conversion sample is written to register 2Ah (Decimal address = 42).
  • At the 50% reset signal, the second ADC conversion sample is written to register 2Bh (Decimal address = 43).
  • At the 75% reset signal, the third ADC conversion sample is written to register 2Ch (Decimal address = 44).
  • At the next 0% reset signal, the fourth ADC conversion sample is written to register 2Dh (Decimal address = 45).
  • Every time the registers 2Ah and 2Bh are updated, the contents of the difference register 2Eh is updated. Similarly, every time the registers 2Ch and 2Dh are updated, the contents of the difference register 2Fh is updated.

The time window between the ADC_RDY (first ADC Reset) and the second ADC Reset represents the window where the contents of all the 6 registers correspond to the samples of the four conversion phases from the previous pulse repetition period.

The MCU could either read all of these registers during this time window, or could read each register separately in the time window where its contents are stable.