米6体育平台手机版

ZHCSOP5B august 2021 – june 2023 AFE7900

PRODUCTION DATA

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		AFE7900	UNIT
		FC-BGA
		400 PINS
R_θJA	Junction-to-ambient thermal resistance	16.2	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	0.42	°C/W
R_θJB	Junction-to-board thermal resistance	4.85	°C/W
Ψ_JT	Junction-to-top characterization parameter	0.12	°C/W
Ψ_JB	Junction-to-board characterization parameter	4.6	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.