5.1.1 Device Features

Table 5-1 Summary of Features Supported by the NWP Subsystem

5.6.1 VBAT Wide-Voltage Connection

In the wide-voltage battery connection, the device is powered directly by the battery or preregulated 3.3-V supply. All other voltages required to operate the device are generated internally by the DC-DC converters. This scheme is the most common mode for the device as it supports wide-voltage operation from 2.1 to 3.6 V (for electrical connections, see Section 6.1.1, Typical Application – CC3200 Wide-Voltage Mode).

5.6.2 Preregulated 1.85 V

The preregulated 1.85-V mode of operation applies an external regulated 1.85 V directly at the pins 10, 25, 33, 36, 37, 39, 44, 48, and 54 of the device. The VBAT and the VIO are also connected to the 1.85-V supply. This mode provides the lowest BOM count version in which inductors used for PA DC-DC and ANA1 DC-DC (2.2 and 1 µH) and a capacitor (22 µF) can be avoided. For electrical connections, see Section 6.1.2, Typical Application – CC3200 Preregulated 1.85-V Mode.

In the preregulated 1.85-V mode, the regulator providing the 1.85 V must have the following characteristics:

• Load current capacity ≥900 mA.
• Line and load regulation with <2% ripple with 500 mA step current and settling time of <4 µs with the load step.
• The regulator must be placed very close to the CC3200 device so that the IR drop to the device is very low.

Table 5-2 User Program Modes

Table 5-3 Networking Subsystem Modes

Table 5-4 Important Chip-Level Power Modes

5.8.1 External Memory Requirements

The CC3200 device maintains a proprietary file system on the SFLASH. The CC3200 file system stores the service pack file, system files, configuration files, certificate files, web page files, and user files. By using a format command through the API, users can provide the total size allocated for the file system. The starting address of the file system cannot be set and is always located at the beginning of the SFLASH. The applications microcontroller must access the SFLASH memory area allocated to the file system directly through the CC3200 file system. The applications microcontroller must not access the SFLASH memory area directly.

The file system manages the allocation of SFLASH blocks for stored files according to download order, which means that the location of a specific file is not fixed in all systems. Files are stored on SFLASH using human-readable file names rather than file IDs. The file system API works using plain text, and file encryption and decryption is invisible to the user. Encrypted files can be accessed only through the file system (see Figure 5-2).

All file types can have a maximum of 128 supported files in the file system. All files are stored in blocks of 4KB and thus use a minimum of 4KB of flash space. Encrypted files with fail-safe support and optional security are twice the original size and use a minimum of 8KB. Encrypted files are counted as fail safe in terms of space. The maximum file size is 16MB.

Table 5-5 lists the SFLASH size recommendations.

The CC3200 device supports JEDEC specification SFDP (serial flash device parameters). The following SFLASH devices are verified for functionality with the CC3200 device in addition to the ones in the reference design:

• Micron (N25Q128-A13BSE40): 128Mb
• Spansion (S25FL208K): 8Mb
• Winbond (W25Q16V): 16Mb
• Adesto (AT25DF081A): 8Mb
• Macronix (MX25L12835F-M2): 128Mb

For compatibility with the CC3200 device, the SFLASH device must support the following commands:

• Command 0x9F (read the device ID [JEDEC]). Procedure: SEND 0x9F, READ 3 bytes.
• Command 0x05 (read the status of the SFLASH). Procedure: SEND 0x05, READ 1 byte. Assume bit 0 is busy and bit 1 is write enable.
• Command 0x06 (set write enable). Procedure: SEND 0x06, read status until write-enable bit is set.
• Command 0xC7 (chip erase). Procedure: SEND 0xC7, read status until busy bit is cleared.
• Command 0x03 (read data). Procedure: SEND 0x03, SEND 24-bit address, read n bytes.
• Command 0x02 (write page). Procedure: SEND 0x02, SEND 24-bit address, write n bytes (0<n<256).
• Command 0x20 (sector erase). Procedure: SEND 0x20, SEND 24-bit address, read status until busy bit is cleared. Sector size is assumed to be always 4K.

5.8.2 Internal Memory

The CC3200 device includes on-chip SRAM to which application programs are downloaded and executed. The application developer must share the SRAM for code and data. To select the appropriate SRAM configuration, see the device variants listed in the orderable addendum at the end of this datasheet. The micro direct memory access (μDMA) controller can transfer data to and from SRAM and various peripherals. The CC3200 ROM holds the rich set of peripheral drivers, which saves SRAM space. For more information on drivers, see the CC3200 API list.

5.9.1 Overview

The boot process of the application processor includes two phases. The first phase consists of unrestricted access to all register space and configuration of the specific device setting. In the second phase, the application processor executes user-specific code.

Figure 5-3 shows the bootloader flow chart.

Note: For definitions of the SoP mode functional configurations, see Table 5-7.

Figure 5-3 Bootloader Flow Chart

5.9.2 Invocation Sequence/Boot Mode Selection

The following sequence of events occur during the Cortex processor boot:

1. After power-on-reset (POR), the processor starts execution.
2. The processor jumps to the first few lines (FFL) of code in the ROM to determine if the current boot is the first device-init boot or the second MCU boot. The determination is based on the Device-Init flag in a secure register. The Device-Init flag is set out of POR. The registers in the secure region are accessible only in the device-init mode.
3. If the current boot is the first boot, the processor executes the device-init code from ROM.
4. At the end of the boot, the processor clears the Device-Init flag and changes the master ID of the processor and the DMA. These registers are part of the secure region.
5. The processor resets itself, initiating a second boot.
6. During the second boot, the processor rereads the Device-Init flag, the bit is cleared, and the processor obtains a different master ID.
7. After executing FFL and the unsecure boot code, the processor jumps to the developer code (application).
8. For the rest of the operation (until the next power cycle), the Cortex mode is designated the MCU. During this phase, access to the secure region is restricted.

5.9.3 Boot Mode List

The CC3200 device implements a sense-on-power (SoP) scheme to determine the device operation mode. The device can be configured to power up in one of the three following modes:

• Fn4WJ: Functional mode with a 4-wire JTAG mapped to fixed pins.
• Fn2WJ: Functional mode with a 2-wire SWD mapped to fixed pins.
• LDfrUART: UART load mode to flash the system during development and in OEM assembly line (for example, serial flash connected to the CC3200R device).

SoP values are sensed from the device pin during power up. This encoding determines the boot flow. Before the device is taken out of reset, the SoP values are copied to a register and then determine the device opeartion mode while powering up. These values determine the boot flow as well as the default mapping for some of the pins (JTAG, SWD, UART0) Table 5-7 show the pull configurations.

The recommended value of pull resistors for SOP0 and SOP1 is 100 kΩ and 2.7 kΩ for SOP2. SOP2 can be used by the application for other functions after chip power-up is complete. However, to avoid spurious SOP values from being sensed at power-up, TI strongly recommends that the SOP2 pin be used only for output signals. On the other hand, the SOP0 and SOP1 pins are multiplexed with WLAN analog test pins and are not available for other functions.