ZHCSM61C November   2014  – September 2020 CC3200MOD

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Functional Block Diagrams
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 CC3200MOD Pin Diagram
    2. 7.2 Pin Attributes
      1. 7.2.1 Module Pin Attributes
    3. 7.3 Pin Attributes and Pin Multiplexing
    4. 7.4 Recommended Pin Multiplexing Configurations
      1. 7.4.1 ADC Reference Accuracy Specifications
    5. 7.5 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    6. 7.6 Pad State After Application of Power to Chip, but Before Reset Release
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Power Consumption Summary
      1. 8.5.1 Current Consumption
    6. 8.6  Brownout and Blackout Conditions
    7. 8.7  WLAN RF Characteristics
      1. 8.7.1 WLAN Receiver Characteristics
      2. 8.7.2 WLAN Transmitter Characteristics
    8. 8.8  Reset Requirement
    9. 8.9  Thermal Resistance Characteristics for MOB and MON Packages
    10. 8.10 Timing and Switching Characteristics
      1. 8.10.1 nRESET
      2. 8.10.2 Wake Up From Hibernate Timing
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Arm® Cortex®-M4 处理器内核子系统
    4. 9.4 CC3200 Device Encryption
    5. 9.5 Wi-Fi® Network Processor Subsystem
    6. 9.6 Power-Management Subsystem
      1. 9.6.1 VBAT Wide-Voltage Connection
    7. 9.7 Low-Power Operating Mode
    8. 9.8 Memory
      1. 9.8.1 External Memory Requirements
      2. 9.8.2 Internal Memory
        1. 9.8.2.1 SRAM
        2. 9.8.2.2 ROM
        3. 9.8.2.3 Memory Map
    9. 9.9 Boot Modes
      1. 9.9.1 Overview
      2. 9.9.2 Invocation Sequence and Boot Mode Selection
      3. 9.9.3 Boot Mode List
  10. 10Applications, Implementation, and Layout
    1. 10.1 Device Connection and Layout Fundamentals
      1. 10.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 10.1.2 Reset
      3. 10.1.3 Unused Pins
      4. 10.1.4 General Layout Recommendations
      5. 10.1.5 Do's and Don'ts
    2. 10.2 Reference Schematics
    3. 10.3 Design Requirements
    4. 10.4 Detailed Design Procedure
    5. 10.5 Layout Recommendations
      1. 10.5.1 RF Section (Placement and Routing)
      2. 10.5.2 Antenna Placement and Routing
      3. 10.5.3 Transmission Line
  11. 11Environmental Requirements and Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 Baking Conditions
    5. 11.5 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
      2. 12.1.2 Firmware Updates
    2. 12.2 Device Nomenclature
    3. 12.3 Documentation Support
    4. 12.4 Trademarks
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical Drawing
    2. 13.2 Package Option
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • MOB|63
散热焊盘机械数据 (封装 | 引脚)

External Memory Requirements

The CC3200 device maintains a proprietary file system on the SFLASH. The CC3200 file system stores the service pack file, system files, configuration files, certificate files, web page files, and user files. By using a format command through the API, users can provide the total size allocated for the file system. The starting address of the file system cannot be set and is always located at the beginning of the SFLASH. The applications microcontroller must access the SFLASH memory area allocated to the file system directly through the CC3200 file system. The applications microcontroller must not access the SFLASH memory area directly.

The file system manages the allocation of SFLASH blocks for stored files according to download order, which means that the location of a specific file is not fixed in all systems. Files are stored on SFLASH using human-readable file names rather than file IDs. The file system API works using plain text, and file encryption and decryption is invisible to the user. Encrypted files can be accessed only through the file system (see Figure 9-2).

All file types can have a maximum of 128 supported files in the file system. All files are stored in blocks of 4KB and thus use a minimum of 4KB of flash space. Encrypted files with fail-safe support and optional security are twice the original size and use a minimum of 8KB. Encrypted files are counted as fail safe in terms of space. The maximum file size is 16MB.

Table 9-4 CC3200 SFLASH Size Recommendations
ITEMTYPICAL FAIL-SAFETYPICAL NONFAIL-SAFE
File system20KB20KB
Service pack224KB112KB
System and configuration files216KB108KB
MCU code512KB256KB
Total4Mb2Mb
Recommended16Mb8Mb

The CC3200 device supports JEDEC specification SFDP (serial flash device parameters). The following SFLASH devices are verified for functionality with the CC3200 device in addition to the ones in the reference design:

  • Micron (N25Q128-A13BSE40): 128 Mb
  • Spansion (S25FL208K): 8 Mb
  • Winbond (W25Q16V): 16 Mb
  • Adesto (AT25DF081A): 8 Mb
  • Macronix (MX25L12835F-M2): 128 Mb

For compatibility with the CC3200 device, the SFLASH device must support the following commands:

  • Command 0x9F (read the device ID [JEDEC]). Procedure: SEND 0x9F, READ 3 bytes.
  • Command 0x05 (read the status of the SFLASH). Procedure: SEND 0x05, READ 1 byte. Assume bit 0 is busy and bit 1 is write enable.
  • Command 0x06 (set write enable). Procedure: SEND 0x06, read status until write-enable bit is set.
  • Command 0xC7 (chip erase). Procedure: SEND 0xC7, read status until busy bit is cleared.
  • Command 0x03 (read data). Procedure: SEND 0x03, SEND 24-bit address, read n bytes.
  • Command 0x02 (write page). Procedure: SEND 0x02, SEND 24-bit address, write n bytes (0 < n < 256).
  • Command 0x20 (sector erase). Procedure: SEND 0x20, SEND 24-bit address, read status until busy bit is cleared. Sector size is always assumed to be 4K.