SCAS892C February   2010  – December 2016 CDCE937-Q1 , CDCEL937-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Control Terminal Setting
      2. 10.3.2 Default Device Setting
    4. 10.4 Device Functional Modes
      1. 10.4.1 SDA and SCL Serial Interface
    5. 10.5 Programming
      1. 10.5.1 Data Protocol
      2. 10.5.2 Command Code Definition
      3. 10.5.3 Generic Programming Sequence
      4. 10.5.4 Byte Write Programming Sequence
      5. 10.5.5 Byte Read Programming Sequence
      6. 10.5.6 Block Write Programming Sequence
      7. 10.5.7 Block Read Programming Sequence
      8. 10.5.8 Timing Diagram for the SDA and SCL Serial Control Interface
      9. 10.5.9 SDA and SCL Hardware Interface
    6. 10.6 Register Maps
      1. 10.6.1 SDA and SCL Configuration Registers
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Spread-Spectrum Clock (SSC)
        2. 11.2.2.2 PLL Multiplier or Divider Definition
        3. 11.2.2.3 Crystal Oscillator Start-Up
        4. 11.2.2.4 Frequency Adjustment With Crystal Oscillator Pulling
        5. 11.2.2.5 Unused Inputs and Outputs
        6. 11.2.2.6 Switching Between XO and VCXO Mode
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Related Links
    3. 14.3 Receiving Notification of Documentation Updates
    4. 14.4 Community Resources
    5. 14.5 Trademarks
    6. 14.6 Electrostatic Discharge Caution
    7. 14.7 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from B Revision (May 2010) to C Revision

  • Changed ApplicationsGo
  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted Ordering Information table; see Package Option Addendum at the end of the data sheetGo

Changes from A Revision (March 2010) to B Revision

  • Changed the PACKAGE THERMAL RESISTANCE tableGo
  • Changed RID default in Generic Configuration Register table From: 0h To: XbGo
  • Added note to PWDN description in Generic Configuration Register tableGo
  • Changed SLAVE_ADR default value in Generic Configuration Register table From: 00b To: 01bGo
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