SCAS901D September   2010  – November 2017 CDCLVD1212

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 LVDS Output Termination
      2. 8.4.2 Input Termination
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Configuration and Functions

RHA Package
40-Pin VQFN
Top View
CDCLVD1212 po_cas901.gif

Pin Functions

PIN TYPE DESCRIPTION
NO. NAME
1 IN_SEL Input with an internal 200-kΩ pullup and pulldown Input selection – selects input port (see Table 1)
2, 3 INP1, INN1 Input Differential redundant input pair or single-ended input
4 VAC_REF1 Output Bias voltage output for capacitive coupled inputs. If used, TI recommends using a 0.1-µF to GND on this pin.
5, 6, 11, 20, 31, 40 VCC Power 2.5-V supplies for the device
7 VAC_REF0 Output Bias voltage output for capacitive coupled inputs. If used, TI recommends using a 0.1-µF to GND on this pin
9, 8 INP0, INN0 Input Differential input pair or single-ended input
10 N.C. No connect
12, 13 OUTP0, OUTN0 Output Differential LVDS output pair no. 0
14, 15 OUTP1, OUTN1 Output Differential LVDS output pair no. 1
16, 17 OUTP2, OUTN2 Output Differential LVDS output pair no. 2
18, 19 OUTP3, OUTN3 Output Differential LVDS output pair no. 3
21, 30 GND Ground Device ground
22, 23 OUTP4, OUTN4 Output Differential LVDS output pair no. 4
24, 25 OUTP5, OUTN5 Output Differential LVDS output pair no. 5
26, 27 OUTP6, OUTN6 Output Differential LVDS output pair no. 6
28, 29 OUTP7, OUTN7 Output Differential LVDS output pair no. 7
32, 33 OUTP8,OUTN8 Output Differential LVDS output pair no. 8
34, 35 OUTP9,OUTN9 Output Differential LVDS output pair no. 9
36, 37 OUTP10,OUTN10 Output Differential LVDS output pair no. 10
38, 39 OUTP11,OUTN11 Output Differential LVDS output pair no. 11
Thermal Pad Ground Device ground. Thermal pad must be soldered to ground. See thermal management recommendations