4 Revision History
Changes from Revision B (October 2021) to Revision C (February 2022)
- 将超薄型封装要点中的厚度从 0.35mm 更改为 0.36mmGo
- 将超薄型封装图片中的厚度从 0.35mm 更新为 0.36mmGo
- Changed ultra-low profile image height from 0.35 mm to 0.36
mm.Go
- Added FemtoFET Surface Mount Guide note.Go
Changes from Revision A (December 2016) to Revision B (October 2021)
- 更新了整个文档中的表格、图和交叉参考的编号格式Go
Changes from Revision * (April 2016) to Revision A (December 2016)
- Changed the TEST CONDITIONS for gfsTransconductance From: VDS = 15 V To: VDS = 3 V in the Section 5.1 section. Go
- Added Section 6.2 in the Section 6 section. Go
- Updated all mechanical drawings. Go