ZHCSBK8D September   2013  – May 2024 CSD19531KCS

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5. 4Specifications
    1. 4.1 Electrical Characteristics
    2. 4.2 Thermal Information
    3. 4.3 Typical MOSFET Characteristics
  6. 5Device and Documentation Support
    1. 5.1 第三方米6体育平台手机版_好二三四免责声明
    2. 5.2 Documentation Support
      1. 5.2.1 Related Documentation
    3. 5.3 接收文档更新通知
    4. 5.4 支持资源
    5. 5.5 Trademarks
    6. 5.6 静电放电警告
    7. 5.7 术语表
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • KCS|3
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision C (March 2017) to Revision D (May 2024)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go

Changes from Revision B (June 2014) to Revision C (March 2017)

    Changes from Revision A (May 2014) to Revision B (June 2014)

    • Added value for max Qg Go

    Changes from Revision * (September 2013) to Revision A (May 2014)

    • 更新了受器件限制电流,以反映器件运行温度范围内的增加量Go
    • 提高了脉冲电流来反映全新条件Go
    • 提高了最大功率耗散来反映全新条件Go
    • 将工作结温范围提高至 175°CGo
    • 更新了脉冲漏极电流条件Go
    • Changed Figure 4-1 from a normalized RθJA curve to a normalized RθJC curve Go
    • Updated Figure 4-6 to reflect increase in device operating temperature range Go
    • Updated Figure 4-8 to reflect increase in device operating temperature range Go
    • Updated Figure 4-10 to reflect measured SOA data Go
    • Updated Figure 4-12 to reflect increase in device operating temperature range Go