SLPS264D October   2010  – May 2015 CSD86330Q3D

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Power Block Performance
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Power Block Device Characteristics
    7. 5.7 Typical Power Block MOSFET Characteristics
  6. 6Application and Implementation
    1. 6.1 Power Loss Curves
    2. 6.2 Safe Operating Curves (SOA)
    3. 6.3 Normalized Curves
    4. 6.4 Calculating Power Loss and SOA
      1. 6.4.1 Design Example
      2. 6.4.2 Calculating Power Loss
      3. 6.4.3 Calculating SOA Adjustments
  7. 7Recommended PCB Design Overview
    1. 7.1 Electrical Performance
    2. 7.2 Thermal Performance
  8. 8Device and Documentation Support
    1. 8.1 Trademarks
    2. 8.2 Electrostatic Discharge Caution
    3. 8.3 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Q3D Package Dimensions
    2. 9.2 Land Pattern Recommendation
    3. 9.3 Stencil Recommendation
    4. 9.4 Q3D Tape and Reel Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DQZ|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from C Revision (October 2011) to D Revision

Changes from B Revision (September 2011) to C Revision

  • Changed "DIM A" Millimeter Max value From: 1.55 To: 1.5 and Inches Max value From: 0.061 To: 0.059Go

Changes from A Revision (December 2010) to B Revision

  • Change RDS(on) to ZDS(on)Go
  • Added Equivalent System Performance sectionGo
  • Added Electrical Performance bulletGo

Changes from * Revision (October 2010) to A Revision

  • Changed IOUT Conditions From: 20A To: 15A, and the TYP value From: 2.9W To: 1.9WGo