ZHCSG79D April   2017  – June 2024 CSD88599Q5DC

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Power Block Performance
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Typical Power Block Device Characteristics
    7. 4.7 Typical Power Block MOSFET Characteristics
  6. 5Application and Implementation
    1. 5.1 Application Information
    2. 5.2 Brushless DC Motor With Trapezoidal Control
    3. 5.3 Power Loss Curves
    4. 5.4 Safe Operating Area (SOA) Curve
    5. 5.5 Normalized Power Loss Curves
    6. 5.6 Design Example – Regulate Current to Maintain Safe Operation
    7. 5.7 Design Example – Regulate Board and Case Temperature to Maintain Safe Operation
    8. 5.8 Layout
      1. 5.8.1 Layout Guidelines
        1. 5.8.1.1 Electrical Performance
        2. 5.8.1.2 Thermal Considerations
      2. 5.8.2 Layout Example
  7. 6Device and Documentation Support
    1. 6.1 接收文档更新通知
    2. 6.2 支持资源
    3. 6.3 Trademarks
    4. 6.4 静电放电警告
    5. 6.5 术语表
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DMM|22
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.3 Trademarks

NexFET and DualCool™ are trademarks of TI.

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.
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