SNAS365G May   2006  – June 2016 DAC082S085

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 Feature Description
        1. 8.2.1.1 DAC Architecture
        2. 8.2.1.2 Output Amplifiers
        3. 8.2.1.3 Reference Voltage
        4. 8.2.1.4 Power-On Reset
    3. 8.3 Device Functional Modes
      1. 8.3.1 Power-Down Modes
    4. 8.4 Programming
      1. 8.4.1 Serial Interface
      2. 8.4.2 Input Shift Register
      3. 8.4.3 DSP and Microprocessor Interfacing
        1. 8.4.3.1 ADSP-2101/ADSP2103 Interfacing
        2. 8.4.3.2 80C51/80L51 Interface
        3. 8.4.3.3 68HC11 Interface
        4. 8.4.3.4 Microwire Interface
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Bipolar Operation
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Using References as Power Supplies
      1. 10.1.1 LM4130
      2. 10.1.2 LM4050
      3. 10.1.3 LP3985
      4. 10.1.4 LP2980
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
        1. 12.1.1.1 Specification Definitions
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resource
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from F Revision (March 2013) to G Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed Thermal Information table Go

Changes from E Revision (March 2013) to F Revision

  • Changed layout of National Data Sheet to TI formatGo
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