- VBIAS, VCC, VOFFSET, VREF, VRESET, VSS are required to operate the DMD.
CAUTION: - For reliable operation of the DMD, the following power supply sequencing requirements must be followed. Failure to adhere to the prescribed power up and power down procedures may affect device reliability.
- The VCC, VREF, VOFFSET, VBIAS, and VRESET power supplies have to be coordinated during power up and power down operations. Failure to meet any of the following requirements will result in a significant reduction in the DMD’s reliability and lifetime. Refer to Figure 9-1. VSS must also be connected.
DMD Power Supply Power Up Procedure:
- During power up, VCC and VREF must always start and settle before VOFFSET, VBIAS and VRESET voltages are applied to the DMD.
- During power up, VBIAS does not have to start after VOFFSET. However, it is a strict requirement that the delta between VBIAS and VOFFSET must be within ±8.75 V (refer to Note 1 for Figure 9-1).
- During power up, the DMD’s LVCMOS input pins shall not be driven high until after VCC and VREF have settled at operating voltage.
- During power up, there is no requirement for the relative timing of VRESET with respect to VOFFSET and VBIAS.
- Power supply slew rates during power up are
flexible, provided that the transient voltage levels follow the requirements listed
previously in Section 6.4 and in Figure 9-1.
DMD Power Supply Power Down Procedure
- VCC and VREF must be supplied until after VBIAS, VRESET, and VOFFSET are discharged to within 4 V of ground.
- During power down it is not mandatory to stop driving VBIAS prior to VOFFSET, but it is a strict requirement that the delta between VBIAS and VOFFSET must be within ±8.75 V (refer to Note 1 for Figure 9-1).
- During power down, the DMD’s LVCMOS input pins must be less than VREF + 0.3 V.
- During power down, there is no requirement for the relative timing of VRESET with respect to VOFFSET and VBIAS.
- Power supply slew rates during power down are
flexible, provided that the transient voltage levels follow the requirements listed
previously in Section 6.4 and in Figure 9-1.