DLPS036B September   2014  – October 2016 DLP9000

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Storage Conditions
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  Timing Requirements
    8. 7.8  Capacitance at Recommended Operating Conditions
    9. 7.9  Typical Characteristics
    10. 7.10 System Mounting Interface Loads
    11. 7.11 Micromirror Array Physical Characteristics
    12. 7.12 Micromirror Array Optical Characteristics
    13. 7.13 Optical and System Image Quality
    14. 7.14 Window Characteristics
    15. 7.15 Chipset Component Usage Specification
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 DLP9000
      2. 9.4.2 DLP9000X
    5. 9.5 Window Characteristics and Optics
      1. 9.5.1 Optical Interface and System Image Quality
      2. 9.5.2 Numerical Aperture and Stray Light Control
      3. 9.5.3 Pupil Match
      4. 9.5.4 Illumination Overfill
    6. 9.6 Micromirror Array Temperature Calculation
    7. 9.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 9.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 9.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 9.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 9.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Typical Application using DLP9000
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
      2. 10.2.2 Typical Application Using DLP9000X
  11. 11Power Supply Requirements
    1. 11.1 DMD Power Supply Requirements
    2. 11.2 DMD Power Supply Power-Up Procedure
    3. 11.3 DMD Mirror Park Sequence Requirements
      1. 11.3.1 DLP9000
      2. 11.3.2 DLP9000X
    4. 11.4 DMD Power Supply Power-Down Procedure
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 General PCB Recommendations
      2. 12.1.2 Power Planes
      3. 12.1.3 LVDS Signals
      4. 12.1.4 Critical Signals
      5. 12.1.5 Flex Connector Plating
      6. 12.1.6 Device Placement
      7. 12.1.7 Device Orientation
      8. 12.1.8 Fiducials
    2. 12.2 Layout Example
      1. 12.2.1 Board Stack and Impedance Requirements
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Device Handling
      2. 13.1.2 Device Nomenclature
      3. 13.1.3 Device Markings
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Thermal Characteristics
    2. 14.2 Package Thermal Resistance
    3. 14.3 Case Temperature

封装选项

机械数据 (封装 | 引脚)
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订购信息

4 Revision History

Changes from A Revision (October 2015) to B Revision

  • Separated TCASE into TARRAY and TWINDOW. Changed TGRADIENT to TDELTA. Reduce DCLK_A,B,C,D for DLP9000 in Absolute Maximum Ratings.Go
  • Separated Tstg into Tdmd and RH in Storage Conditions.Go
  • Changed TDMD to TARRAY and TGRADIENT to TDELTA, added short term operational, and updated temperature values in Recommended Operating Conditions.Go
  • Added the four modes of operation.Go
  • Removed the column showing the pixel data rate and added the pattern mode pattern rates.Go
  • Updated CL2w constant in Micromirror Array Temperature Calculation.Go
  • Added recommended idle mode operation for maximizing mirror useful life.Go
  • Updated Micromirror Derating Curve.Go
  • Added mirror park sequence requirements.Go
  • Updated device nomenclature and markings.Go

Changes from * Revision (September 2014) to A Revision

  • Updated title Go
  • Updated Features, Description, and Device Information to include DLP9000XFLS DMD.Go
  • Added DLP9000XFLS application diagram.Go
  • Updated Absolute Maximum Ratings to include DLP9000XFLS absolute maximum ratings.Go
  • Updated Recommended Operating Conditions to include DLP9000XFLS recommended operating conditions.Go
  • Updated Electrical Characteristics to include DLP9000XFLS electrical characteristics.Go
  • Updated Timing Requirements to include DLP9000XFLS timing requirementsGo
  • Updated Typical Characteristics tables to have pixel data rates and patttern rates for both the DLP9000FLS and the DLP9000XFLS.Go
  • Updated Device Functional Modes section to include DLP9000X functional description.Go
  • Updated Application and Implementations section to include typical application for the DLP9000XFLS.Go
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