SLVSH22 May 2024 DRV8000-Q1
ADVANCE INFORMATION
As there are multiple drivers and types of drivers on this device, there are multiple dedicated thermal sensors located on chip to monitor key block temperatures on the chip itself. Each of these sensors, called thermal clusters, measure local die temperature for specific device blocks. These measurements can be converted to a voltage for output on IPROPI pin, used to trigger temperature warnings or to shutdown a specific cluster which is exceeding acceptable temperature range or the entire device.
The device response to thermal cluster warnings can be configured with bit OTSD_MODE in the IC_CNFG1 register:
There are four zones defined with thermal clusters, shown in the table and diagram below:
Thermal Cluster 1 | Thermal Cluster 2 | Thermal Cluster 3 | Thermal Cluster 4 |
---|---|---|---|
Half-bridges OUT5, OUT1 and OUT2 | Half-bridges OUT3, OUT4 and OUT6 | All high-side drivers | Global and remaining drivers |
For each zone, there are comparator-based warnings for two temperature points, 115° for low and 140°C for high. Bit ZONEX_OTW_X (L or H) is latched in register IC_STAT2. Each warning can be individually disabled with bit ZONEX_OTW_X_DIS in register IC_CNFG2. If overtemperature shutdown occurs, ZONEX_OTSD bit is latched in register IC_STAT2.