ZHCSRO2 February   2023 DS160PR1601

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD and Latchup Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 High Speed Electrical Characteristics
    7. 6.7 SMBUS/I2C Timing Charateristics
    8. 6.8 Typical Characteristics
    9. 6.9 Typical Jitter Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Control and Configuration Interface
      1. 7.3.1 Pin Configurations for Lanes
        1. 7.3.1.1 Five-Level Control Inputs
      2. 7.3.2 SMBUS/I2C Register Control Interface
      3. 7.3.3 SMBus/I 2 C Primary Mode Configuration (EEPROM Self Load)
    4. 7.4 Feature Description
      1. 7.4.1 Linear Equalization
      2. 7.4.2 Flat-Gain
      3. 7.4.3 Analog EyeScan
      4. 7.4.4 Receiver Detect State Machine
      5. 7.4.5 Integrated Capacitors
    5. 7.5 Device Functional Modes
      1. 7.5.1 Active PCIe Mode
      2. 7.5.2 Active Buffer Mode
      3. 7.5.3 Standby Mode
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 PCIe x16 Lane Configuration
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  10. 10Mechanical, Packaging, and Orderable Information

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Detailed Design Procedure

In PCIe Gen 3.0 and 4.0 applications, the specification requires Rx-Tx (of root-complex and endpoint) link training to establish and optimize signal conditioning settings. In link training, the Rx partner requests a series of FIR – preshoot and deemphasis coefficients (10 Presets) from the Tx partner. The Rx partner includes 7-levels of CTLE followed by a single tap DFE. The link training would pre-condition the signal, with an equalized link between the root-complex and endpoint resulting an optimized link. Note that there is no link training in PCIe Gen 1.0 (2.5 Gbps) or PCIe Gen 2.0 (5.0 Gbps) applications.

The DS160PR1601 is designed with linear datapth to pass the Tx Preset signaling (by root complex and end point) onto the Rx (of root complex and end point) for a PCIe link to train and optimize for the Rx equalization settings. The linear redriver helps extend the PCB trace reach distance by boosting the attenuated signals with its own equalization, which allows the Rx to recover signals more easily. The device must be placed in between the Tx and Rx (of root complex and end point) such a way that signal swing of both upstream and downstream signals stays within the linearity range of the device. Adjustments to the DS160PR1601 EQ setting should be performed based on the channel loss to optimize the eye opening in the Rx partner. The available EQ gain settings are provided in Table 7-4. For most PCIe systems the default Flat gain setting of 0 dB (flat_gain = 101) would be sufficient.

The DS160PR1601 can be optimized for a given system utlizing its two configuration modes – SMBus/I2C Primary mode and SMBus/I2C Secondary mode. In SMBus/I2C modes the SCL, SDA pins must be pulled up to a 3.3 V supply with a pull-up resistor. The value of the resistor depends on total bus capacitance. 4.7 kΩ is a good first approximation for a bus capacitance of 10 pF.

#T5877368-6 shows a simplified schematic for x16 lane configuration in SMBus/I2C Primary mode.

Figure 8-2 Simplified Schematic for PCIe x16 Lane Configuration in SMBus/I2C Primary Mode