ZHCS600D december   2011  – december 2020 HD3SS212

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Function
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Test Timing Diagrams
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 AC Coupling Caps
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  11.   Power Supply Recommendations
  12. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  13. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resource
    3. 11.3 Trademarks
  14. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)HD3SS212UNIT
nFBGA (ZXH)
48-Ball
θJAJunction-to-ambient thermal resistance64.9°C/W
θJCtopJunction-to-case (top) thermal resistance28.7°C/W
θJBJunction-to-board thermal resistance36.4°C/W
ψJTJunction-to-top characterization parameter1.0°C/W
ψJBJunction-to-board characterization parameter36.1°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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