ZHCSEP9C december   2015  – december 2020 HD3SS214

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings #GUID-AEF84F8B-5035-497D-BF42-BEE5DCF32E24/SLAS9018663 #GUID-AEF84F8B-5035-497D-BF42-BEE5DCF32E24/SLAS9012713
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics, Device Parameters
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High Speed Switching
      2. 7.3.2 HPD, AUX, and DDC Switching
      3. 7.3.3 Output Enable and Power Savings
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Dual GPU With Docking Station Support
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 DP Inputs
        2. 8.2.3.2 Source Selection Interface
      4. 8.2.4 DP++ Support
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
          1. 8.2.4.2.1 AUX and DDC Switching
          2. 8.2.4.2.2 CONFIG1 and CONFIG2 Routing
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layer Stack
      2. 10.1.2 Differential Traces
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from , to , (from Revision B (June 2017) to Revision C (December 2020))

  • 将标题 和特性 从DisplayPort 1.3 更改为DisplayPort 1.4Go
  • 注：采用 MicroStar Jr. BGA 封装的器件采用层压 nFBGA 封装进行了重新设计。这种 nFBGA 封装提供了类似于数据表中的电气性能。该封装占用空间也类似于 MicroStar Jr. BGA。将在整个数据表中更新全新封装标识符来代替已停止使用的封装标识符。Go
  • 将 u*jr BGA 更改为 nFBGAGo
  • Changed u*jr ZQE to nFBGA ZXHGo
  • Changed DC2(p) to DC2(n) in Pin FunctionsGo
  • Changed DC2(n) to DC2(p) in Pin FunctionsGo
  • Changed u*jr ZQE to nFBGA ZXH. Updated thermal data.Go

Changes from Revision A (July 2016) to Revision B (June 2017)

  • 将标题 和特性 从DisplayPort 1.3 更改为DisplayPort 1.4Go

Changes from Revision * (December 2015) to Revision A (July 2016)

  • Changed DC2(p) to DC2(n) in Pin FunctionsGo
  • Changed DC2(n) to DC2(p) in Pin FunctionsGo
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