ZHCSRC3A December   2022  – March 2024 IWRL6432

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 功能方框图
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configurations and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Signal Descriptions
      1.      11
      2.      12
      3.      13
      4.      14
      5.      15
      6.      16
      7.      17
      8.      18
      9.      19
      10.      20
      11.      21
      12.      22
      13.      23
      14.      24
      15.      25
      16.      26
      17.      27
    3.     28
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.5.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.5.2 Hardware Requirements
      3. 7.5.3 Impact to Your Hardware Warranty
    6. 7.6  Power Supply Specifications
      1. 7.6.1 Power Optimized 3.3V I/O Topology
      2. 7.6.2 BOM Optimized 3.3V I/O Topology
      3. 7.6.3 Power Optimized 1.8V I/O Topology
      4. 7.6.4 BOM Optimized 1.8V I/O Topology
      5. 7.6.5 System Topologies
        1. 7.6.5.1 Power Topologies
          1. 7.6.5.1.1 BOM Optimized Mode
          2. 7.6.5.1.2 Power Optimized Mode
      6. 7.6.6 Internal LDO output decoupling capacitor and layout conditions for BOM optimized topology
        1. 7.6.6.1 Single-capacitor rail
          1. 7.6.6.1.1 1.2V Digital LDO
        2. 7.6.6.2 Two-capacitor rail
          1. 7.6.6.2.1 1.2V RF LDO
          2. 7.6.6.2.2 1.2V SRAM LDO
          3. 7.6.6.2.3 1.0V RF LDO
      7. 7.6.7 Noise and Ripple Specifications
    7. 7.7  Power Save Modes
      1. 7.7.1 Typical Power Consumption Numbers
    8. 7.8  Peak Current Requirement per Voltage Rail
    9. 7.9  RF Specification
    10. 7.10 Supported DFE Features
    11. 7.11 CPU Specifications
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 Timing and Switching Characteristics
      1. 7.13.1  Power Supply Sequencing and Reset Timing
      2. 7.13.2  Synchronized Frame Triggering
      3. 7.13.3  Input Clocks and Oscillators
        1. 7.13.3.1 Clock Specifications
      4. 7.13.4  MultiChannel buffered / Standard Serial Peripheral Interface (McSPI)
        1. 7.13.4.1 McSPI Features
        2. 7.13.4.2 SPI Timing Conditions
        3. 7.13.4.3 SPI—Controller Mode
          1. 7.13.4.3.1 Timing and Switching Requirements for SPI - Controller Mode
          2. 7.13.4.3.2 Timing and Switching Characteristics for SPI Output Timings—Controller Mode
        4. 7.13.4.4 SPI—Peripheral Mode
          1. 7.13.4.4.1 Timing and Switching Requirements for SPI - Peripheral Mode
          2. 7.13.4.4.2 Timing and Switching Characteristics for SPI Output Timings—Secondary Mode
      5. 7.13.5  RDIF Interface Configuration
        1. 7.13.5.1 RDIF Interface Timings
        2. 7.13.5.2 RDIF Data Format
      6. 7.13.6  General-Purpose Input/Output
        1. 7.13.6.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      7. 7.13.7  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 7.13.7.1 Dynamic Characteristics for the CANx TX and RX Pins
      8. 7.13.8  Serial Communication Interface (SCI)
        1. 7.13.8.1 SCI Timing Requirements
      9. 7.13.9  Inter-Integrated Circuit Interface (I2C)
        1. 7.13.9.1 I2C Timing Requirements
      10. 7.13.10 Quad Serial Peripheral Interface (QSPI)
        1. 7.13.10.1 QSPI Timing Conditions
        2. 7.13.10.2 Timing Requirements for QSPI Input (Read) Timings
        3. 7.13.10.3 QSPI Switching Characteristics
      11. 7.13.11 JTAG Interface
        1. 7.13.11.1 JTAG Timing Conditions
        2. 7.13.11.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 7.13.11.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 功能方框图
    3. 8.3 Subsystems
      1. 8.3.1 RF and Analog Subsystem
      2. 8.3.2 Clock Subsystem
      3. 8.3.3 Transmit Subsystem
      4. 8.3.4 Receive Subsystem
      5. 8.3.5 Processor Subsystem
      6. 8.3.6 Host Interface
      7. 8.3.7 Application Subsystem Cortex-M4F
      8. 8.3.8 Hardware Accelerator (HWA1.2) Features
        1. 8.3.8.1 Hardware Accelerator Feature Differences Between HWA1.1 and HWA1.2
    4. 8.4 Other Subsystems
      1. 8.4.1 GPADC Channels (Service) for User Application
      2. 8.4.2 GPADC Parameters
    5. 8.5 Memory Partitioning Options
    6. 8.6 Boot Modes
  10. 9 Monitoring and Diagnostics
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Reference Schematic
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
  • AMF|102
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 Revision History

Changes from December 31, 2022 to March 8, 2024 (from Revision * (December 2022) to Revision A (March 2024))

  • （特性）：删除了范围规格中的“短距离”Go
  • （特性）：将噪声系数从 12.5dB 更新为 11dBGo
  • （特性）：向封装说明中添加了“BGA 焊球”Go
  • （应用）：添加了新应用Go
  • （说明）：将工作频率范围更新为 57-63.9GHzGo
  • （封装信息）：添加了新的量产器件型号Go
  • （封装信息）：删除了预量产器件型号Go
  • （方框图）：更新了功能方框图Go
  • (Device feature comparison) : xWRL1432 addedGo
  • (Device feature comparison) : xWR1843AOP addedGo
  • (Device feature comparison) : Note added for "Complience targeted" devicesGo
  • (Device feature comparison) : Production status changed from AI to PDGo
  • (Related Products) : Reference design link updated.Go
  • (Signal description) : Ball F5 added to VSSAGo
  • (Clock Signal Descriptions) : Description added for RTC_CLK_IN.Go
  • (Absolute Maximum Ratings) : VPP absolute maximum rating has been addedGo
  • (VPP specification) : New section added with VPP specificationsGo
  • (Power supply specifications) : IOs updatedGo
  • (Power Optimized 3.3V I/O Topology) : VNWA supply added.Go
  • (BOM Optimized 3.3V I/O Topology) : VNWA IO addedGo
  • (BOM Optimized 1.8V I/O Topology) : VNWA IO addedGo
  • (System Topologies) : Description added for each of the two system topologies.Go
  • (Power Topologies) : Introduction updated with more information regarding the two power topologies.Go
  • (Internal LDO output De-cap and layout conditions for BOM optimized topology) : New section added addressing range for de-coupling capacitor values and output path parasitic values.Go
  • (Noise and ripple specification) : 1.8Vnoise and ripple specification note addedGo
  • (Typical Power Consumption Numbers) : Estimated Power Consumed in 3.3V IO Mode table - Power consumption for power optimized and BOM optimized modes updated.Go
  • (Typical Power Consumption Numbers) : Estimated Power Consumed in 1.8V IO Mode - Power consumption for power optimized and BOM optimized modes updated.Go
  • (Typical Power Consumption Numbers) : Table footnote removed.Go
  • (Typical Power Consumption Numbers) : Introduction updated with device condition and ambient temperature.Go
  • (Typical Power Consumption Numbers) : Use-Case Power Consumed in 3.3V Power Optimized Topology table - average power consumption number updated to 1.2mW from 2.52mWGo
  • (Peak Current Requirement per Voltage Rail) : Maximum current drawn by all nodes driven by 1.8V rail in the power optimized 1.8V IO is changed to 360mA from 270mA.Go
  • (RF specification) : Updated noise figure from 12.5dB to 11 dBGo
  • (RF specification) : Frequency range updated to 57 to 63.9 GHzGo
  • (RF specification) : Receiver and Transmitter S11 addedGo
  • (RF specification) : Noise figure, In-band P1dB vs Receiver gain plot updated Go
  • (Supported DFE features) : Supported ADC sampling rates updatedGo
  • (Supported DFE features) : Low-pass filter bullet order changed.Go
  • (Supported DFE features) : Timing engine paragraph updatedGo
  • (Supported DFE features) : Chirp profile supported by timing engine figure updatedGo
  • (Power supply sequencing) : 1.2V, 1.8V and VIOIN power up synced. Go
  • (Power supply sequencing) : SOP1 sequence updatedGo
  • (Clock Specifications) : External Clock Mode Specifications table - units of DCV correctedGo
  • (RDIF Interface Configuration) : 100Mbps removed from supported data rates. Go
  • (SCI Timing Requirements) : Supported baud rates addedGo
  • （方框图）：更新了功能方框图Go
  • (Clock subsystem) : Updated diagram Go
  • (Clock subsystem) : Removed "77 to 81GHz spectrum" from introduction.Go
  • (Clock subsystem) : Updated operating frequency rangeGo
  • (Transmit Subsystem) : Updated Transmit Subsystem diagram Go
  • (Application Subsystem): Section name changed from Main Subsystem to Application SubsystemGo
  • (GPADC channels) : APPSS Cortex M4F included.Go
  • (Monitoring and Diagnostics) : Section addedGo
  • (Application Information) : Links updatedGo
  • (Device nomenclature) : Package type updatedGo
  • (Device nomenclature) : Updated reflecting production part numberGo
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